1500 m Infrared Laser Illuminator JDD-1500-HDX
Specification Snapshot
Operating temperature
-40°C~+70°C
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Specifications
| Parameter | Value |
|---|---|
| Wavelength | 808±5nm |
| Laser Chip | Optical Power 15 W |
| Output optical power | Optical Power 11±1 W |
| Illumination Angle | Motorized Synchronous Zoom 65°~1° Continuously Adjustable |
| Zoom speed [Optical, Near Angle-Far Angle] | Approximately 4 Seconds (Optical, Near Angle-Far Angle) |
| Illumination Performance | Uses time-integrated homogenization for uniform, smooth supplementary illumination throughout the focal range, with no speckle |
| Illumination Distance | Effective Distance >1500 m |
| Control Method | Photosensitive mode/command mode |
| Brightness Setting | Automatic dimming / Manual |
| Operating voltage [DC;±10%] | DC12V±10% |
| Max Power consumption [±10%] | 36W±10% |
| Storage temperature | -40°C~+80°C |
| Operating temperature | -40°C~+70°C |
| Machine Service Life | Greater than 30000 hours |
| Overall dimensions [Length * Width * Height] | Length * Width * Height: 132*56*60mm |
| Weight | approximately 380g |
| Communication Method [Baud rate :9600bps] | TTL3.3V/RS485( Baud rate :9600bps) |
Key Features
Absolute safety:must follow IEC, CIE, EN requirements, IEC 60825-1:2014 and GB 7247.1-2012. Energy saving:55% chip conversion, over 50% less consumption for equal coverage. Temporal-integration homogenization gives fine speckle-free fill across zoom;continuous 65°~1° for telephoto lenses. Single-chip diode reliability, strict -40°C~+70°C tests, life >30000 hours, reference Telecordia468/NASA reliability standards;integration with pan-tilts, lenses, cameras reduces development cost/time.
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Supplier Information
Wuxi Gedad Optoelectronic Technology Co., Ltd. is a high-tech enterprise focusing on the R&D, production and sales of strategic emerging industries such as compound semiconductor packaging, precision packaging equipment, and packaging materials. Through continuous R&D investment, the company has fully mastered core technologies in the packaging of GaN lasers, GaAs lasers, and InP lasers. With self-developed equipment and materials, it can provide various packaging forms and devices including single-tube COS, TO, Mount packaging, single Bar packaging, and fiber-coupled modules, as well as customized products. Products are widely used in information technology, display and lighting, life and health, lidar, material processing, optical communication, scientific research and other fields.
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