KCH-A Series Bus Communication and Power Hub KCH-A4
KCH-A-series communication-bus and power hubs are designed for Oeabt-series C-module controllers. They simplify cable management, power distribution and communication among multiple USB devices, while conveniently connecting peripherals such as beam-analysis cameras and external hard drives.
Save to Favorites
Overview
Specifications
| Parameter | Value |
|---|---|
| Specifications | 307.5 mm × 84.2 mm × 31.4 mm |
| Number of Integrated Positions | 4 positions |
| Input Power [Max] | 12V*8A=96W Max，5V*2A=10W Max，Total：106W/Max |
| Output Power [Max] | 12V*8A=96W Max，5V*2A=10W Max，Total：106W/Max |
| Interface Type | 1 USB3.0-B interface, 1 DB15 combined power terminal, 2 USB3.0-A interfaces |
| Weight | 681.9 g |
| Power [Max] | 12V*8A=96W Max,5V*2A=10W Max,Total:106W/Max |
Key Features
Datasheet
Supplier Information
Related Products
-
AMB/DBC Substrate CO2 Laser Scribing Machine CPP12
Semiconductor Packaging Equipment
Delphilaser
Equipment Type: Single Head, Single Platform, Standalone/Automated Working area: 200mm×200mm(customizable) Positioning accuracy: ±3μm
This equipment is mainly used for laser scribing in the DBC industry and is widely used in packaging fields such as power electronic modules, semiconductor cooling and LED devices.
-
AMB/DBC Substrate CO2 Laser Scribing Machine CPP21
Semiconductor Packaging Equipment
Delphilaser
Equipment Type: Dual Heads, Dual Platforms, Automated Working area: 200mm×200mm(customizable) Positioning accuracy: ±3μm
This equipment is mainly used for laser scribing in the DBC industry and is widely used in packaging fields such as power electronic modules, semiconductor cooling and LED devices.
-
AMB/DBC Substrate CO2 Laser Scribing Machine CPP30
Semiconductor Packaging Equipment
Delphilaser
Equipment Type: Single Head, Single Platform, Automated Working area: 200mm×200mm(customizable) Positioning accuracy: ±3μm
This equipment is mainly used for laser scribing in the DBC industry and is widely used in packaging fields such as power electronic modules, semiconductor cooling and LED devices.
-
Compact Air-Cooled Nanosecond Laser All-in-One Unit Coral-A Series Coral UV-A
Semiconductor Packaging Equipment
Bellinlaser
Spot Mode: TEM₀₀(M²<1.3) Beam diameter: 0.5-1mm Power stability [RMS over 8 hours]: <3% RMS over 8 hours
-
Compact Air-Cooled Nanosecond Laser All-in-One Unit Coral-A Series Coral GR-A
Semiconductor Packaging Equipment
Bellinlaser
Spot Mode: TEM₀₀(M²<1.3) Beam diameter: 0.5-1mm Power stability [RMS over 8 hours]: <3% RMS over 8 hours
Related Articles
Founded in 2019, Jilin JC Ultrafast Equipment Co., Ltd. is a high-tech enterprise incubated by the Ultrafast Optoelectronics Center of Jilin University. Our R&D team owns 15 years of profound experience in femtosecond laser micro-nano fabrication.
Driven by the rapid upgrading of industrial automation, high-precision displacement sensing technology has become a core foundation of intelligent manufacturing.
Founded in 2003, BWT Beijing Optoelectronics adheres to the mission "Let Dreams Fly With Light" and vision of becoming a Global Leader in Laser Solutions, guided by the core value "Innovate to Achieve Extraordinary".
On November 28, 2024, the 3rd China Laser Star Enterprise Summit & Advanced Laser Processing Technology Summit, an annual influential event in the laser industry, was grandly held in Wuhan Optics Valley.
Loading...
Name
Phone
Organization
Use Case
Database Platform