High-Power Semiconductor Single-Emitter Chip -1940nm-2W-CW
Specification Snapshot
Center wavelength λ_c [After chip packaging (COS); 25°C; CW current mode]
Typical :1940 nm
Width F [After chip packaging (COS); 25°C; CW current mode]
Typical :400 μm
Thickness D [After chip packaging (COS); 25°C; CW current mode]
Min :125 μm; Typical :135 μm; Max :145 μm
Threshold current Iₜₕ [After chip packaging (COS); 25°C; CW current mode]
Typical :2.7 A; Max :3.0 A
Operating current Iₒₚ [After chip packaging (COS); 25°C; CW current mode]
Typical :12.5 A; Max :13.0 A
Operating voltage Vₒₚ [After chip packaging (COS); 25°C; CW current mode]
Typical :1.12 V; Max :1.2 V
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Specifications
| Parameter | Value |
|---|---|
| Center wavelength λ_c [After chip packaging (COS); 25°C; CW current mode] | Typical :1940 nm |
| Output Power P_opt [After chip packaging (COS); 25°C; CW current mode] | Typical :2 W |
| Operating mode [After chip packaging (COS); 25°C; CW current mode] | Typical :CW |
| Polarization [After chip packaging (COS); 25°C; CW current mode] | Typical :TE |
| Emitting Region Width E.W [After chip packaging (COS); 25°C; CW current mode] | Typical :190 μm |
| Cavity length L [After chip packaging (COS); 25°C; CW current mode] | Typical :3000 μm |
| Width F [After chip packaging (COS); 25°C; CW current mode] | Typical :400 μm |
| Thickness D [After chip packaging (COS); 25°C; CW current mode] | Min :125 μm; Typical :135 μm; Max :145 μm |
| Threshold current Iₜₕ [After chip packaging (COS); 25°C; CW current mode] | Typical :2.7 A; Max :3.0 A |
| Operating current Iₒₚ [After chip packaging (COS); 25°C; CW current mode] | Typical :12.5 A; Max :13.0 A |
| Operating voltage Vₒₚ [After chip packaging (COS); 25°C; CW current mode] | Typical :1.12 V; Max :1.2 V |
| Spectral width △λ [After chip packaging (COS); 25°C; CW current mode; FWHM] | Typical :10 nm |
| Slope efficiency η [After chip packaging (COS); 25°C; CW current mode] | Typical :0.22 W/A |
| Electro-optical conversion efficiency η_c [After chip packaging (COS); 25°C; CW current mode] | Typical :15 % |
| Fast axis Divergence angle θ⊥ [After chip packaging (COS); 25°C; CW current mode; FWHM] | Typical :39 Deg; Max :44 Deg |
| Slow axis Divergence angle θ∥ [After chip packaging (COS); 25°C; CW current mode; FWHM] | Typical :9 Deg; Max :12 Deg |
| Operating temperature [After chip packaging (COS); 25°C; CW current mode] | Typical :25 °C |
Applications
Industrial pumping; laser equipment; biomedicine; scientific research
Key Features
High-power, high-efficiency epitaxial structure design; high-quality epitaxial growth; specialized facet coating technology; low-divergence technology
Datasheet
Product Datasheet
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Supplier Information
JLight Semiconductor Technology Co., Ltd. was founded in 2020, headquartered in Changchun, Jilin Province. It is a high-tech enterprise focusing on the R&D and manufacturing of semiconductor laser chips and lasers. The company's core products include high-power semiconductor laser chips and fiber-coupled lasers, with wavelengths covering 450nm to 2050nm, meeting diverse demands in biomedical, industrial pumping, high-end laser equipment and frontier scientific research fields. The company has established an internationally leading full-process technology platform, covering key steps such as MOCVD epitaxial growth, wafer fabrication, cleaving and coating, chip packaging, testing and characterization, and reliability verification. It possesses one-stop technical solution capabilities from chip foundry to functional module development. Leveraging its independent and controllable advanced process system, the company has built core technological advantages across the entire chain from chip design and manufacturing process to packaging and testing.
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