C Series High-Power Semiconductor Laser
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Specifications
| Parameter | Value |
|---|---|
| Output Power [25℃] | Typical:15 W |
| Center wavelength [25℃] | Typical:1550±10 |
| Spectral Width (90% Energy) [25℃] | Typical:<10.0 nm |
| Wavelength – Temperature Coefficient [25℃] | Typical:0.3 nm /℃ |
| Threshold current [25℃] | Typical:0.5 A |
| Operating current [25℃] | Typical:7 A |
| Operating voltage [25℃] | Typical:12 V |
| Slope efficiency [25℃] | Typical:2.3 W / A |
| Energy Conversion Efficiency [25℃] | Typical:17.5 % |
| Aiming Beam - Output Power [25℃] | Typical:2 mW |
| Aiming Beam - Center Wavelength [25℃] | Typical:650±10 |
| Aiming Beam - Operating Current [25℃] | Typical:<30 mA |
| Aiming Beam - Operating Voltage [25℃] | Typical:5 V |
| Fiber core diameter [25℃] | Typical:200 μm |
| Cladding diameter [25℃] | Typical:220 μm |
| Coating Diameter [25℃] | Typical:500 μm |
| Numerical aperture [25℃] | Typical:0.22 |
| Fiber length [25℃] | Typical:1-5 m |
| Operating temperature | Min:15 ℃；Max:35 ℃ |
| Operating Relative Humidity | Max:75 % |
| Cooling method | Max:Water cooling (25℃) |
| Storage temperature | Min:-20 ℃；Max:80 ℃ |
| Storage Relative Humidity | Max:90 % |
| Pin Soldering Temperature (Maximum 10s) | Max:250 ℃ |
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Key Features
Datasheet
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