EFEM Wafer Inspection Platform

Wavelength Range: 380~1000 nm Thickness range: 15 nm~70 um Detector: Linear array CCD

The FTM Thin-Film Thickness Spectral Measurement System uses the interference phenomenon of light reflected from the film surface and the substrate material to quickly and non-destructively measure film thickness. The film thickness measurement range is 1nm-1mm. The materials to be measured mainly include PET, oxides, nitrides, and protective coating layers, etc. Typically, the substrate materials of these coated films include silicon wafers or glass, etc. It can also measure the thickness of copper foil, and is widely used in semiconductors and industrial production.

Wavelength Range: 220~1100 nm Thickness range: 1 nm~100 um Detector: Area-array CCD

The FTM Thin-Film Thickness Spectral Measurement System uses the interference phenomenon of light reflected from the film surface and the substrate material to quickly and non-destructively measure film thickness. The film thickness measurement range is 1nm-1mm. The materials to be measured mainly include PET, oxides, nitrides, and protective coating layers, etc. Typically, the substrate materials of these coated films include silicon wafers or glass, etc. It can also measure the thickness of copper foil, and is widely used in semiconductors and industrial production.