High-temperature flange type radar level transmitter
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Specifications
| Parameter | Value |
|---|---|
| Product Type | Flange |
| Beam angle | 3° |
| Near blind zone | 0.3m |
| LCD screen | Yes |
| Maximum distance | ≤120m |
| Distance Measurement Accuracy | ±2mm |
| Power Supply | 24V |
| Current | 4~20mA |
| Refresh rate | 4s |
| Communication Interface | Two-wire/4-20mA/HART |
| Operating Temperature | -20~60℃ |
| Process temperature | -40~250℃ |
| Pressure | -0.1~2.5MPa |
| Universal | Not supported |
| Purge | Not supported |
| Explosion-proof | Not supported |
| Corrosion-resistant | Support |
| Ingress Protection Rating | IP67 |
| Process connection | ≥DN80 flange |
Applications
Corrosion Resistance; High-pressure Resistance; High-temperature Resistance; Petrochemicals and Chemicals; Iron, Steel and Metallurgy; Energy; Cement; Rivers and Reservoirs; Water and Environmental Protection; Corrosive, High-pressure and High-temperature Operating Conditions
Key Features
Frequency-modulated continuous-wave (FMCW) technology provides accuracy up to ±2mm, a 120m range and a blind zone as small as 0.3m. It withstands process temperatures from -40℃ to 250℃ and pressures up to 2.5Mpa, with corrosion resistance available. Standard mA, HART and communication outputs support limit, circuit-fault and communication-fault alarms. Suitable for a wide range of tanks and solid or liquid media. A narrow 3° beam, strong interference immunity and false-echo suppression provide reliable measurement.
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Supplier Information
HIKMICRO is a company focused on infrared thermal imaging as its core, providing multi-dimensional perception technology, products, and solutions to help industries and individuals better perceive the world.
HIKMICRO deeply cultivates high-value-added MEMS, optoelectronic devices, and sensor technologies, providing intelligent instruments, IoT cores, modules, thermal imaging products, and solutions globally.
The Tonglu sensor factory covers an area of 85 acres, with an 8-inch MEMS production line cleanroom area of 12,000 m² and a purification level of up to Class 10. It has a world-class team for integrated circuit design, MEMS design, MEMS/packaging process development, application product development, and sales services. The company has an annual production capacity of 30,000 sensor wafers and over ten million various visual sensors.
Currently, the company's complete machine product production line covers 20,000 m², with a total of 28 complete machine production lines and 9 core component production lines, with a maximum annual output of 3.9 million units. The entire manufacturing process strictly follows high-quality production requirements for manufacturing and testing. Materials undergo multiple standard inspections and careful selection; the production process is strictly controlled, with core components fully automated, packaged in dust-free cleanrooms; before leaving the factory, products undergo multiple strict performance tests such as high and low temperature, normal temperature environmental temperature accuracy testing, aging testing, and air tightness testing to ensure stable and reliable product quality.
The instrument factory covers an area of 8,800 m² and has precision processing, packaging, welding, assembly, calibration, and testing capabilities for various sensors such as pressure, flow, level, and temperature. It is equipped with ultra-high temperature blackbody calibration, high-precision long-distance radar calibration, high-precision pressure verification, and high-precision large-diameter flow calibration systems to ensure factory accuracy from the source. It adopts automated, information-based, and intelligent production lines and automotive-grade quality control systems to ensure consistency and stability of the manufacturing process. The flexible production model meets diverse customer needs.
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