bonding crystal
Key-composed crystals allow molecular dispersion and the formation of stable chemical keys on the finely processed crystal surface through high temperature thermal processing
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Overview
Specifications
| Parameter | Value |
|---|---|
| Dimensions Diameter | 1~50mm |
| Dimensional Tolerance Diameter | +0/-0.04mm |
| Parallelism | ≤10″ |
| Chamfer | 0.15±0.05mm |
| Clear Aperture Diameter | >95% |
| Technical indicator photopurity | 10/5 (MIL-O-13830A)（Standard=MIL-O-13830A） |
| Technical indicator pillar processing | Fine、Shine、Thread |
| Wavefront Distortion | ≤λ/10 per inch@632.8nm（Wavelength=632.8nm） |
| Extinction Ratio | ≥30dB |
| Coating | R<0.15%@1064nm（Wavelength=1064nm；Membrane=Permeability） |
| Coating | R<0.5%@808nm（Wavelength=808nm；Membrane=Permeability） |
| Coating | R<0.15%@532nm（Wavelength=532nm；Membrane=Permeability） |
| Coating | Partial reflection film:R=(10~90)%±2%@1064nm（Wavelength=1064nm） |
| Coating | R>99.8%@1064nm（Wavelength=1064nm；Membrane=High Reveal） |
| Coating | R>99.8%@808nm（Wavelength=808nm；Membrane=High Reveal） |
Applications
Key Features
Datasheet
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Supplier Information
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