Cell phone camera laser cutting intelligence equipment
Use of infrared-skinned lasers, liner PSO control; application of skin-species to silk cutting; efficient, high-precision cutting of different thickness glass; extensive application in industries such as 3C, automobiles, optical lenses, etc
Save to Favorites
Overview
Specifications
| Parameter | Value |
|---|---|
| Average output power | ≥30W/≥40W |
| Pulse width | <10ps |
| Single pulse energy | >150uj(150KHz)/>270uj(150KHz) |
| Line-wire power valid itinerary | 300×300 mm |
| Repeat location precision | ±1μm |
| Pixels | 11 million pixels, position accuracy 0.003 mm (selected) |
| Thickness of cutting product | 0.08mm-0.8mm |
| Reconciliation | Electric Focus |
| Quantity of material | 1 basket of 34 products2 |
| Specification of electricity supply | 220V/50HZ/8KW |
| Environmental requirements | Temperature of 20-26°C and 50% ± 5% humidity |
| Equipment weight | About 1.9 T |
Applications
Key Features
Datasheet
Please provide your email to download the datasheet.
Invalid email format. Please try again.
Supplier Information
Related Products
-
ATM50 Fully Automatic Laser Coding Equipment (On boat)
Laser Processing Equipment
Delphilaser
Slot Type Magazine-Product Length: 100-320mm Slot Type Magazine-Product Width: 45-180mm Slot Type Magazine-Handler slot magazine Capacity [Calculated for 180 x320mm]: 2 (Calculated for 180 x320mm)
This equipment uses a laser to mark individual devices on a BOAT with customized QR codes, characters, LOGO and other patterns.
-
ATM90 Fully Automatic Laser Marking Machine (MiniQFN)
Laser Processing Equipment
Delphilaser
Workpiece Dimensions: Max 280 x 100mm；Min 150 x 60mm Print Content: 2D, Logo, PIN, Text Printing Specifications-Depth Control: ±6um
Fully automatic laser marking of packaged semiconductor Mini QFN products.
-
BUSBAR Laser Cleaning Equipment
Laser Processing Equipment
Delphilaser
Equipment Dimensions: L2.5m×W2.0m×H2.7m Terminal Cleaning Area: 160 mm × 160 mm
BUSBAR laser cleaning for new-energy battery modules.
-
BUSBAR Laser Welding Equipment
Laser Processing Equipment
Delphilaser
Equipment Dimensions: L2.8m×W2.0m×H2.7m Equipment Operating Efficiency [Calculated by Battery Cell Count]: ≥10PPM(Calculated by Battery Cell Count) Compatible Battery Modules: L1200mm×W200mm×H240mm
BUSBAR laser welding for new-energy battery modules.
-
DPC Ceramic Substrate Rapid Drilling Equipment RPS10
Laser Processing Equipment
Delphilaser
Equipment Type: Single Head Working area: 250mm×250mm/450mm×450mm(customizable) Positioning accuracy: ±3μm
Depending on thickness, material and processing-quality requirements, drilling or cutting equipment can be selected for drilling, cutting or punching most DPC ceramics, including alumina (Al2O3), aluminum nitride (AlN) and zirconia (ZrO2).
Related Articles
Founded in 2019, Jilin JC Ultrafast Equipment Co., Ltd. is a high-tech enterprise incubated by the Ultrafast Optoelectronics Center of Jilin University. Our R&D team owns 15 years of profound experience in femtosecond laser micro-nano fabrication.
Driven by the rapid upgrading of industrial automation, high-precision displacement sensing technology has become a core foundation of intelligent manufacturing.
Founded in 2003, BWT Beijing Optoelectronics adheres to the mission "Let Dreams Fly With Light" and vision of becoming a Global Leader in Laser Solutions, guided by the core value "Innovate to Achieve Extraordinary".
On November 28, 2024, the 3rd China Laser Star Enterprise Summit & Advanced Laser Processing Technology Summit, an annual influential event in the laser industry, was grandly held in Wuhan Optics Valley.
Loading...
Name
Phone
Organization
Use Case
Database Platform