SiC Wafer Intelligent Laser Marking Equipment LUV3220 / LUV3320
Laser-marking equipment tailored to the high-siC hardness characteristics; completion of permanent markings such as crystal circle ID, DIE, 2D code; backtracking of crystal circle throughout its life cycle
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Overview
Specifications
| Parameter | Value |
|---|---|
| Equipment model | LUV3220/LUV3320 |
| Light | UV |
| Average output power | >5W |
| Up and down | Full Auto |
| Crystal Circle Size | 6/8inch |
| Mark depth | 0~5m@softmark, 5~100m@hardmark |
| Call precision | ≤100μm |
| Automation | Open CST, FOUP, POD |
Key Features
Datasheet
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