SiC Wafer Modification-Cutting Intelligent Equipment LUSD3310
Dynamic focus compensation modules developed through self-development; alignment with high-precision floating line motion platforms; achievement of high-precision, high-consistent crystal round processing; processing quality up to industry lead; configuration of standard design for hidden exterior optical black boxes; stable transmission of laser beams; stable output laser energy; process stability; autonomous development of cutting and visual software; provision of customized functional modules
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Overview
Specifications
| Parameter | Value |
|---|---|
| Equipment model | LUSD3310 |
| Laser Light | Infrared |
| Up and down | Full Auto, CST to CST |
| Process materials | 6/8inch SiC |
| Process speed | ≥500mm/s |
Key Features
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