Smart equipment for TGV glacial plate drilling
TGV (Through Glass Via), a glass perforation device; a combination of laser-induced modifications and chemical etching; and the formation of a massive perforated structure inside the glass. Extensively used in chip wrapping and glass base plate processing Medium
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Overview
Specifications
| Parameter | Value |
|---|---|
| Average output power | >20W |
| Process performance | min: 30μm |
| Specification of electricity supply | 220V/50HZ/8KW |
| Environmental requirements | Temperature 20 ~ 26 °C and humidity 50 ~ 5% |
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Datasheet
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