COS Seal
General-type COS sealing; supporting the LD chip COS co-chip sticker process; capable of achieving high precision chip patching. At the same time; support customization of heat deposition designs; optimize heat management with high-conductor heat materials; improve reliability and stability of containment
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Overview
Specifications
| Parameter | Value |
|---|---|
| Paste Precision | ±3μm,±5μm |
| Thermal materials | Aluminium Nitrous (ABN), Aluminium Oxide (Aluminium Al2O3), Copper Tungsten (CuW), CuMo |
| Sealing process | Welding, Flip Chip |
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Key Features
Datasheet
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Supplier Information
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