PDN for series PDN0700GB

PDN for series PDN0700GB

Supplier
Mvstek
Part Number
PDN0700GB
Category
Scientific & Industrial Cameras
Origin
China

Industrial-grade structure light 3D camera, scanning using MEMS coded raster light, allowing rapid generation of spot cloud data to maintain high accuracy, efficiency and sustained

Specification Snapshot
Camera Weight
593g
Light
850nm
Resolution
1280x1024
Data Interface
GigE
Operating Temperature
0-50°C
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Overview

Industrial-grade structure light 3D camera, scanning using MEMS coded raster light, allowing rapid generation of spot cloud data to maintain high accuracy, efficiency and sustained stability within a field of view

Specifications

ParameterValue
Camera ModelPDN0700G(B)
Camera Dimensions136mm×64mm×52.5mm
Camera Weight593g
Light850nm
Recommended Working Distance350mm-700mm
Near Field of View263mmx291mm
Far Field of View511mmx638mm
Resolution1280x1024
Collection Time0.8-1.3s
Scan ModeSingle-banded/continuous scanning
Trigger ModeSoft Trigger
Point Cloud FormatPCD、PLY. TXT
Image TypeGreyscale, depth
Data InterfaceGigE
Average Power Consumption6.0W
Minimum Power Input24V/1A
Operating Temperature0-50°C
Cooling Flow Rate5-10L/min(0.2-0.3MPa)
Airflow NoiseLess than 70 dB (50 cm)

Applications

Medical assistance; automotive manufacturing; intelligent welding; 3D reconstruction; logistics sorting; aerospace.

Key Features

Proprietary MEMS structured-light projection module; near-infrared laser source with imperceptible scanning; binocular structured-light principle; PC-based processing; straightforward software operation with support for secondary development.

Datasheet

Product Datasheet
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Supplier Information

Mv
Mvstek
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Wuxi Microvision Sensing Technology Co., Ltd. is located in Xishan Economic Development Zone, Wuxi, Jiangsu. Founded in July 2019, it is a high-tech company focusing on MEMS chips and application module development. The founding team has been conducting MEMS chip research since 2008 and began focusing on MEMS micro-mirror chips and their application modules, products, and solutions in 2013. The company has launched domestically produced high-performance, low-cost, miniaturized MEMS micro-mirror chips, structured light projection modules, and 3D depth cameras. These products are widely used in 3D payment, 3D machine vision, security, LiDAR, laser micro-projection, and optical communications. The company has established cooperation with leading enterprises in various industries in China.

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