PDN0700GC
Industrial-grade structure light 3D camera, scanning using MEMS coded raster light, allowing rapid generation of spot cloud data to maintain high accuracy, efficiency and sustained
Specification Snapshot
Camera Weight
550g
Light
850nm
Resolution
1280x1024
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Overview
Industrial-grade structure light 3D camera, scanning using MEMS coded raster light, allowing rapid generation of spot cloud data to maintain high accuracy, efficiency and sustained stability within a field of view
Specifications
| Parameter | Value |
|---|---|
| Camera Model | PDN0700G(C) |
| Camera Dimensions | 136mm×65mm×35mm |
| Camera Weight | 550g |
| Light | 850nm |
| Recommended Working Distance | 350mm-700mm |
| Near Field of View | 263mmx291mm |
| Far Field of View | 511mmx638mm |
| Resolution | 1280x1024 |
| Collection Time | 0.8-1.3s |
| Scan Mode | Single-banded/continuous scanning |
| Trigger Mode | Soft Trigger |
| Point Cloud Format | PCD、PLY.TXT |
| Image Type | Greyscale, depth |
| Average Power Consumption | 10.2W |
| Minimum Power Input | 24V/1A |
| Cooling Flow Rate | 5-10L/min(0.2-0.3MPa) |
| Airflow Noise | Less than 70 dB (50 cm) |
Applications
Medical assistance; automotive manufacturing; intelligent welding; 3D reconstruction; logistics sorting; aerospace.
Key Features
Proprietary MEMS structured-light projection module; near-infrared laser source with imperceptible scanning; binocular structured-light principle; PC-based processing; straightforward software operation with support for secondary development.
Datasheet
Product Datasheet
PDF
Supplier Information
Wuxi MVSTek Sensor Technology Co., Ltd. is located in Xishan Economic and Technological Development Zone, Wuxi, Jiangsu. Founded in July 2019, it is a high-tech company with MEMS chip and application module development as its core technology.
The founding team has been conducting MEMS chip-related research since 2008, and since 2013 has focused on MEMS micromirror chips and their application modules, products, and solutions.
The company has launched domestically produced high-performance, low-cost, miniaturized MEMS micromirror chips, structured light projection modules, and 3D depth cameras. Related products can be widely used in 3D payment, 3D machine vision, security, LiDAR, laser micro-projection, and optical communication. Currently, it has cooperated with several leading domestic industry application companies.
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