High Precision Optical Glass 1/9 Inch Series OV9734 Endoscope Lenses for Medical
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Smart equipment for TGV glacial plate drilling
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Average output power: >20W Process performance: min: 30μm Specification of electricity supply: 220V/50HZ/8KW
TGV (Through Glass Via), a glass perforation device; a combination of laser-induced modifications and chemical etching; and the formation of a massive perforated structure inside the glass. Extensively used in chip wrapping and glass base plate processing Medium
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submount
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Side metalification; product size 2.825*1* 0.127; unit mm; small size; 0.3*1* 0.127. Horizontal and vertical face-to-face accuracy > 5 μm
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Hot
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Lined on thermal deposition; metalted surfaces to Ti, Pt, Au, Cr, Cu, Sn, Ag or Ausn welds, etc.; thickness and composition can be customised
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Membrane circuit
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Bore film electrical resistance material: TaN、Pt、NiCr Face resistance: 10Ω/□、50Ω/□、100Ω/□ Precision Absorption: Laser offset (0.5 per cent)
1 small electrical resistance; 50 large electrical resistance; 5 per cent precision; 10 per cent special precision; 0.5 per cent precision of electrons
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ceramics
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Membrane structure: Cr/Ni/Au=100~150nm/300~400nm/500~600nm, 1200~1300nm, 2800~3000nm; Ti/Pt/Au=100~150nm/200~300nm/500~600nm, 1200~1300nm, 2,800~3000nm Membrane: Ion spatter, evaporated deposition with ion aid Graphical technology: Semiconductor optical, laser etching; nano mask + photogram; lift-off
Submount, pottery thermal sunk, ceramic capacitor, thin membrane electrical resistance; metalization patterns; pottery piece products such as prefabricated gold tin; size, performance parameters, etc., can be tailored to the customer ' s needs
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Founded in 2003, BWT Beijing Optoelectronics adheres to the mission "Let Dreams Fly With Light" and vision of becoming a Global Leader in Laser Solutions, guided by the core value "Innovate to Achieve Extraordinary".
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