JAL-IMX135-E08B V2.0
SONY IMX135 MIPI Autofocus 1300;
Specification Snapshot
Model Group Dimensions
17.50 x 9.60 mm
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Overview
SONY IMX135 MIPI Autofocus 1300; Model JAL-IMX135-E08B V2.0. Chip IMX135; Focal Length 3.85 mm; 2.2; 3136 x 4224; 72.9°; Optical Lens 1/3.06; Optical Lens Dimensions 8.5 x 8.5 x 5.6 mm; Dimensions 17.50 x 9.60 mm; Autofocus; MIPI
Specifications
| Parameter | Value |
|---|---|
| Iris | 2.2V |
| Pixels | 3136 x 4224W |
| Visual angle | 72.9° |
| Model Group Dimensions | 17.50 x 9.60 mm |
| Module Type | Autofocus |
| Match Connector | 24-5804-030-000-829s |
Key Features
MopTe uminated and stacked type CMOS aimage sensor Exmor RS searial communication circuit on chip serial data output (2Lane/4LaLne selectable) on chip r generator, horizontal (H) and vertical (V) driver circuits on chip e i GA on chip a A/D converter on chip m atic optical black (OB) clamp circuit on chip K ensitivity, low dark current, no smear, excellent anti-blooming characteristics e-speed shutter function (Minimum unit: One horizontal sync signal period). primary color pigment mosaic filters on chip w ts external mechanical shutter ontrol pulse generation function w 4 frame/s in all-pixel scan mode ate: 360 MHz (all pixels, 4Lane, 24 frame/s) tws 720/60 p, 1080/30 p, 1080/60 p drive *NOTE wn and/or right/left inversed readout function nning readout function cutout function OM (One Time Programmable Read Only Memory) 8 K-bit for user, 10 K-bit as a whole on reset function compensation processing functions (defect correction, noise reduction) ynamic Range (HDR) and tone reproduction in movie mode ase ask about the details of a required register.
Datasheet
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Supplier Information
Kai Lap Technologies Group Limited (KLT), established in 2009, is a next-generation technology-driven manufacturer specializing in R&D, design and production of audio and video products. With a 20,000 sq. ft. automated plant and 100 employees, the company has an annual output of 30 million cameras. KLT provides OEM, ODM design and contract manufacturing services, offering customized one-stop solutions from concept to mass production, including custom design, raw material management, electronic engineering, firmware/software development, product testing and packaging design. Its products are widely applied in various camera modules.
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