KLT-X2MF-OX02A10 V1.0
OmniVision OX02A10 MIPI Focal Length 100 M12;
Specification Snapshot
Model Group Dimensions
40.00 x 24.00 mm
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Overview
OmniVision OX02A10 MIPI Focal Length 100 M12; Model KLT-X2MF-OX02A10 V1.0. Chip OX02A10; Focal Length 3.47 mm; 2.2; 1824 x 940; 157°(D) 133°(H) 72°(V); Optical Lens 1/2.09; Optical Lens Dimensions 14.00 X 14.00 X 20.31 mm; Dimensions 40.00 x 24.00 mm; Focal Length; MIPI
Specifications
| Parameter | Value |
|---|---|
| Iris | 2.2V |
| Pixels | 1824 x 940W |
| Model Group Dimensions | 40.00 x 24.00 mm |
| Module Type | Focal Length |
| Match Connector | DF30FC-30DS-0.4V |
Applications
Factory Tour Contact Us 100 Focal Length + MIPI OmniVision OX02A10 KLT-X2MF-OX02A10 V1.0 OmniVision OH01A10 KLT-6AMF-OH01A10 V1.0 OmniVision OV9281 KLT-E4MPF-OV9281 V4.2 KLT-E3MPF-OV9281 V2.0 KLT-E4MPF-OV9281 V4.0 KLT-E4MPF-OV9281 V3.0 KLT-E4MPF-OV9281 V2.0 KLT-S7MF-OV9281 V1.0 KLT-K2MPF-OV9281 V1.0 KLT-E4MPF-OV9281 V1.0 KLT-E3MPF-OV9281 V1.0 OmniVision OV9714 KLT-K3MF-OV9714 V1.1 OmniVision OV9732 KLT-USB1ACM-OV9732 V2.1 On Semiconductor Aptina AR0144 KLT-T3MPF-AR0144 V1.0 Home >> Products >> 100 Focal Length + MIPI >> OmniVision OX02A10 >> KLT-X2MF-OX02A10 V1.0 OmniVision OX02A10 MIPI Focal Length 100 M12 Model. KLT-X2MF-OX02A10 V1.0 Model KLT-X2MF-OX02A10 V1.0 Chip OX02A10 Focal Length 3.47 mm 2.2 1824 x 940 157°(D) 133°(H) 72°(V) Optical Lens 1/2.09 Optical Lens Dimensions 14.00 X 14.00 X 20.31 mm Dimensions 40.00 x 24.00 mm Focal Length MIPI DF30FC-30DS-0.4V KLT Camera Modules
Datasheet
Product Datasheet
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Supplier Information
Kai Lap Technologies Group Limited (KLT), established in 2009, is a next-generation technology-driven manufacturer specializing in R&D, design and production of audio and video products. With a 20,000 sq. ft. automated plant and 100 employees, the company has an annual output of 30 million cameras. KLT provides OEM, ODM design and contract manufacturing services, offering customized one-stop solutions from concept to mass production, including custom design, raw material management, electronic engineering, firmware/software development, product testing and packaging design. Its products are widely applied in various camera modules.
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