640 MWIR Imaging Core Module
1. Easy integration into complete systems, CameraLink image interface, RAW/YUV image data output; 2. 16-bit ADC, modular design of the core board, interface display board and power board, providing different types of core board combinations; 3. Clear image quality, smooth imaging, and multiple continuous zoom optical configurations available.
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Overview
1. Easy integration into complete systems, CameraLink image interface, RAW/YUV image data output; 2. 16-bit ADC, modular design of the core board, interface display board and power board, providing different types of core board combinations; 3. Clear image quality, smooth imaging, and multiple continuous zoom optical configurations available.
Specifications
| Parameter | Value |
|---|---|
| Performance Spec - Resolution - Pixel Pitch | 640*512-15μm |
| CoolDown Time | ≤5min |
| Performance Spec - Typical NETD | ~18mk |
| Performance Spec - Response Band | 3μm~5μm |
| Image Processing - Frame Rate | 15/30/60Hz |
| Image Processing - Image Orientation | Horizontal/vertical/diagonal directions |
| Image Processing - Image Bit Depth | 16-bit |
| Image Processing - Image Algorithm | Non-uniformity correction (NUC), adaptive dynamic compression (AGC); self-developed noise reduction algorithm, digital detail enhancement (DDE) |
| Image Processing - Application Scenario | Security monitoring, pods, gas detection, shipborne and vehicle-mounted electro-optical systems, as well as fire control and sights |
| Electrical Characteristics - Analog Video | PAL or NTSC |
| Electrical Characteristics - Digital Video | 3G-SDI, Cameralink RAW/YUV image data output |
| Electrical Characteristics - Data Interface | Gigabit Ethernet port; USB3.0-C (optional) |
| Electrical Characteristics - Communication Interface | RS422,115200bps |
| Electrical Characteristics - Power Supply | 12~28V DC |
| Electrical Characteristics - Power Stability | 13W |
| Electrical Characteristics - Dimensions | 132mm*57mm*71mm (excluding lens) |
| Electrical Characteristics - Weight | ≤750g |
| Electrical Characteristics - Operating Temperature | -40℃~+60℃ |
| Electrical Characteristics - Compatible Lenses | Continuous zoom: 30~240mm/F415~300mm/F430~300mm F5.5 etc. |
Datasheet
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Supplier Information
Zhejiang Qunteng Infrared Technology Co., Ltd. (abbreviated as Qunteng Infrared) was founded in September 2017, headquartered in Jiaxing, Zhejiang Province, with a registered capital of 90.386982 million yuan. The company specializes in the R&D and production of cooled infrared chips, detectors, and laser chips, and is a leading domestic manufacturer of infrared imaging chips, recognized as a national-level specialized and innovative "Little Giant" enterprise. Its core team consists of international infrared material experts and senior semiconductor process engineers, mastering core technologies in Type-II superlattice infrared detectors. It has established a complete detector chip mass production line and is the first in China to achieve mass production of high-end Type-II superlattice mid-wave and long-wave cooled infrared detectors and camera core modules, and is also the pioneer of high-temperature HOT T2SL cooled detectors. Additionally, the company is building a comprehensive VCSEL product lineup covering various wavelengths, powers, and sizes, aiming to become a mainstream global VCSEL supplier.
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