Wafer Thickness/TTV/Warpage Automatic Measurement Equipment APS Series
Suitable for overall thickness inspection of silicon wafers and compound semiconductor samples (GaAs, InP, SiC, GaN) and parameter inspection such as TTV/BOW/Warp warpage. The equipment is compatible with both transparent and opaque wafers. It uses a non-contact measurement method that is precise and fast. Using a white-light source with an upper and lower dual-probe design, the sample is placed between the two probes during testing, and one test quickly provides all information related to sample thickness and geometric parameters: thickness, TTV, Bow, Warp, TIR, LTV, etc. The equipment can also be equipped with infrared interference probes. 01 Fully automatic measurement Extremely simple operation, easy online programming settings, automatic measurement, Mapping mode supported; 02 Powerful measurement functions One test can simultaneously obtain all data: thickness, TTV, Bow, Warp, TIR, LTV, etc.; 03 Fast measurement speed Supports flying-spot sampling, quickly completing measurements and saving production time; 04 Wide application scenarios The APS series can adapt to many different products, scenarios and needs, providing you with the optimal solution
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