Wafer 3D Metrology Equipment WPM Series
White-light interferometry, spectral reflectance and chromatic confocal in one! Programmed measurement: intelligent arrays, automatic measurement, autofocus, automatic positioning, Data Feedback database management; High ease of use, automatic retesting, data statistical analysis with more analysis functions, one-click report generation; More functions: lean manufacturing modules such as data statistical analysis support customized development.; 01 Rich measurement functions Roughness/film thickness/step height/critical dimensions/Warpage/Bow/Stress/; 02 Ultra-high measurement accuracy Profile repeatability 0.03 nm Step height accuracy 0.3% XY maximum repeatability 0.19μm; 03 Ultra-high inspection efficiency Ultra-fast scanning speed: 5 times that of conventional models Fully automatic measurement: online programming settings, automatic measurement Offline analysis: original data can be secondarily analyzed for specific purposes
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Overview
Specifications
| Parameter | Value |
|---|---|
| Topography Repeatability | 0.03nm |
| Step Height Accuracy | 0.3% |
| XY Maximum Repeatability | 0.19μm |
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