Wafer 3D Metrology Equipment WPM Series
White-light interferometry, spectral reflectance and chromatic confocal in one! Programmed measurement: intelligent arrays, automatic measurement, autofocus, automatic positioning, Data Feedback database management; High ease of use, automatic retesting, data statistical analysis with more analysis functions, one-click report generation; More functions: lean manufacturing modules such as data statistical analysis support customized development.; 01 Rich measurement functions Roughness/film thickness/step height/critical dimensions/Warpage/Bow/Stress/; 02 Ultra-high measurement accuracy Profile repeatability 0.03 nm Step height accuracy 0.3% XY maximum repeatability 0.19μm; 03 Ultra-high inspection efficiency Ultra-fast scanning speed: 5 times that of conventional models Fully automatic measurement: online programming settings, automatic measurement Offline analysis: original data can be secondarily analyzed for specific purposes
Save to Favorites
Overview
Specifications
| Parameter | Value |
|---|---|
| Topography Repeatability | 0.03nm |
| Step Height Accuracy | 0.3% |
| XY Maximum Repeatability | 0.19μm |
Applications
Datasheet
Please provide your email to download the datasheet.
Invalid email format. Please try again.
Supplier Information
Related Products
-
GF PLUS series dual exchange platform GF3015Plus
Semiconductor Packaging Equipment
Hglaser
Machine-bed process: 1530; 3050; 250mm Contact maximum position speed: 140m/min Speed up: 1.2G
The GF PLUS series of two-way exchange platforms, using an autonomous fibre-optic laser generator; providing users with robust cutting power and efficiency; equipping specialized laser cutting control systems; gathering high stability, characterization, high power, high performance; speed faster than one; and cutting-edge machines for metal material processing!
-
GF PLUS series dual exchange platform GF4022Plus
Semiconductor Packaging Equipment
Hglaser
Machine-bed process: 2230; 4050; 250mm Contact maximum position speed: 140m/min Speed up: 1.2G
The GF PLUS series of two-way exchange platforms, using an autonomous fibre-optic laser generator; providing users with robust cutting power and efficiency; equipping specialized laser cutting control systems; gathering high stability, characterization, high power, high performance; speed faster than one; and cutting-edge machines for metal material processing!
-
GF PLUS series dual exchange platform GF6025Plus
Semiconductor Packaging Equipment
Hglaser
Machine-bed process: 2530; 6050; 250mm Contact maximum position speed: 140m/min Speed up: 1.2G
The GF PLUS series of two-way exchange platforms, using an autonomous fibre-optic laser generator; providing users with robust cutting power and efficiency; equipping specialized laser cutting control systems; gathering high stability, characterization, high power, high performance; speed faster than one; and cutting-edge machines for metal material processing!
-
GF PLUS series dual exchange platform GF8025Plus
Semiconductor Packaging Equipment
Hglaser
Machine-bed process: 2530; 8050; 250mm Contact maximum position speed: 140m/min Speed up: 1.2G
The GF PLUS series of two-way exchange platforms, using an autonomous fibre-optic laser generator; providing users with robust cutting power and efficiency; equipping specialized laser cutting control systems; gathering high stability, characterization, high power, high performance; speed faster than one; and cutting-edge machines for metal material processing!
-
GF PLUS series dual exchange platform GF10025Plus
Semiconductor Packaging Equipment
Hglaser
Machine-bed process: 2530; 10050; 250mm Contact maximum position speed: 140m/min Speed up: 1.2G
The GF PLUS series of two-way exchange platforms, using an autonomous fibre-optic laser generator; providing users with robust cutting power and efficiency; equipping specialized laser cutting control systems; gathering high stability, characterization, high power, high performance; speed faster than one; and cutting-edge machines for metal material processing!
Related Articles
As a professional manufacturer of precision optical thin-film components, sycco-optics (Shandong Yanggu Hengjing Optoelectronics) launches high-performance 850nm narrow band pass filters for near-infrared precision detection, intelligent sensing and optical imaging systems. Adopting advanced vacuum coating technology, the filter realizes high transmittance in the target band and deep blocking in interference bands. It effectively eliminates stray light and spectral noise, serving as a core optical component for machine vision, biochemical detection and photoelectric sensing equipment.
Wuhan Optics Valley Quantum Technology Co., Ltd. is a leading domestic developer of high‑speed semiconductor optical chips and photodetector components. Our product portfolio covers InGaAs avalanche photodiode bare dies and PIN photodetector chips designed for fiber‑optic communication
A microlens array (MLA) is a high-precision optical component composed of hundreds or thousands of tiny, uniformly arranged micro lenses on a single flat substrate. Unlike traditional single lenses that focus one light beam, a microlens array can split, homogenize, and reshape light on a micro scale. It is widely paired with VCSELs, lasers, and image sensors, becoming a core part of modern miniature optical systems.
Shandong Huaguang Optoelectronics Co., Ltd. (HAUCORE) is a leading high-tech manufacturer of compound semiconductor optoelectronic devices, founded in 1999 and headquartered in Jinan, China, with two R&D and production bases in Jinan and Weifang.
Loading...
Name
Phone
Organization
Use Case
Database Platform