DM Series LWP-D322C-IS
DM (IP67)RGBD Camera, iTOF Chip (SONY DepthSense^TM ), RK3588 Chip (6Tops ); (HDR) (56fps)
Specification Snapshot
ToF
68° (±2) x 50° (±2)
resolution
640 x 480 dpidB
Frame Rate
Max.28 fps; Max.56 fps
Power
15W
Weight
366g
Operating Temperature
-30℃~65℃
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Overview
DM (IP67)RGBD Camera, iTOF Chip (SONY DepthSense^TM ), RK3588 Chip (6Tops ); (HDR) (56fps); 3D AI Application. Product Application, AGV/, AGV
Specifications
| Parameter | Value |
|---|---|
| ToF | 68° (±2) x 50° (±2) |
| resolution | 640 x 480 dpidB |
| Frame Rate | Max.28 fps; Max.56 fps |
| Protection Rating | IP67 |
| Operating System | Windows10 /Linux |
| Principle | ToF (Time-of-flight) depth camera |
| Ranging accuracy | ±3mm+0.25%depth |
| ToF | 71° (±2) x 58° (±2) |
| resolution | 1600 x 1200 dpidB |
| eye safety | Class 1 |
| Exposure time | 0-4000μs exposure time adjustment |
| filter | Supports multiple filter settings such as spatial, time domain, confidence, and flying points |
| Output data type | Depth、IR、PointCloud、IMU、RGB(YUV) |
Key Features
DM (IP67)RGBD Camera, iTOF Chip (SONY DepthSense^TM ), RK3588 Chip (6Tops ); (HDR) (56fps); 3D AI Application. Product Application, AGV/, AGV
Datasheet
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Supplier Information
Hangzhou LuminWave Technology Co., Ltd. (LuminWave), founded in 2018, is a leading global provider of LiDAR and 3D sensor hardware and perception solutions. With self-developed silicon photonic chip technology, software and perception algorithm capabilities, it provides FMCW LiDAR, 3D industrial cameras and cost-effective perception solutions. Headquartered in Hangzhou, with R&D centers in Xi'an, Hefei, Beijing, and Los Angeles. Its products are widely used in smart driving, intelligent logistics, industrial automation, robotics and other fields.
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