Electroformed Hub Dicing Blade

Electroformed Hub Dicing Blade

Supplier
Zzqsjm
Category
Tools and Machinery
Origin
China

The electroformed nickel-based bond is used to integrate diamond abrasives and precision aluminum alloy flanges. It has the characteristics of high toughness, high strength, and ultra-thin blade, and is suitable for dicing narrow blocks of semiconductor wafers

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Overview

The electroformed nickel-based bond is used to integrate diamond abrasives and precision aluminum alloy flanges. It has the characteristics of high toughness, high strength, and ultra-thin blade, and is suitable for dicing narrow blocks of semiconductor wafers

Applications

Wafer

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Supplier Information

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Zzqsjm
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<p>Since its establishment in 2014, Qisheng Precision has been focusing on the semiconductor and precision manufacturing industry, specializing in R&D and manufacturing of dicing equipment, superhard tools, and precision grinding products. It is one of the few high-tech enterprises in China that truly achieves dual-track independent R&D of "equipment + tools". Core strengths: integrated R&D and manufacturing, three business divisions, full-chain capability; professional R&D team mastering core technologies. Core products: precision dicing machines, full series of dicing blades (electroformed, resin, metal), precision grinding products (thinning wheels, ceramic chucks, etc.). Applications: integrated circuits, LED chips, optical components, new energy batteries, electronic ceramics, magnetic materials. Served thousands of enterprises across 30 provinces. Vision: Perseverance, proactiveness, harmonious work, self-transcendence; striving for innovation and precision.</p>

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Electroformed Hub Dicing Blade
Zzqsjm · Tools and Machinery
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