Specifications
| Parameter | Value |
|---|---|
| Speed Range | 5000-60000RPM |
| Output Power | 1.8KW |
| X Axis Dicing Speed | 0.01-800mm/s |
| Y Axis Method | + |
| Y Axis Resolution | 0.0001mm |
| Y Axis Single-Step Accuracy | 0.002/5mm |
| Y Axis Cumulative Accuracy | 0.004/300mm |
| Z Axis Method | + |
| Z Axis Resolution | 0.001mm |
| T Axis Method | DD |
| T Axis Rotation Angle Range | 0-320°( Optional 380°) |
| T Axis Resolution | 0.0004 |
| T Axis Accuracy | 3” |
| T Axis Basic Specification | AC380V±10% 5kw |
| Processing Size | Φ12” 300X300mm |
| Function Configuration | · · Automatic · · BBD · · Automatic · · Automatic · · Automatic · Automatic · · NCS |
| Cutting Water | 0.2-0.4 MPa: 3L/min |
| Cooling Water | 0.2-0.4 MPa: 1.5Lmin |
| Exhaust Air Volume | 5m³/min |
| Outline Dimensions | 1080mmx1040mmx1900mm |
| Cutting Straightness | 0.003mm/280mm |
| Worktable Flatness | 0.008mm/Φ200mm 0.010mm/□260mm |
| X Y Axis Perpendicularity | 0.015mm/200mm |
| Y Axis Step Accuracy | 0.002/5mm |
| Spindle X Axis Parallelism | 0.001mm/30mm |
| Cutting Water | 1. Cutting Water ±2°C, 0.2-0.4MPa, 2 φ12mm, 115mm. 3 φ50mm, 615mm |
| Spindle Cooling Water | 1. Cooling Water ( Spindle ), ±2°C, 0.2-0.4MPa. 2. Cooling Water: φ8mm, 115mm |
| Mist Extraction Pipe | Mist Extraction Pipe φ80mm, 1.5m³/min, 1060mm |
Applications
Wafer, Gallium Arsenide, Lithium Niobate, Ceramic, Glass, PCB Board. IC, LED, NTC, QFN
Key Features
Aerostatic Spindle, Material; Spindle; Automatic; Optional, QFN, BGA
Datasheet
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Supplier Information
<p>Since its establishment in 2014, Qisheng Precision has been focusing on the semiconductor and precision manufacturing industry, specializing in R&D and manufacturing of dicing equipment, superhard tools, and precision grinding products. It is one of the few high-tech enterprises in China that truly achieves dual-track independent R&D of "equipment + tools". Core strengths: integrated R&D and manufacturing, three business divisions, full-chain capability; professional R&D team mastering core technologies. Core products: precision dicing machines, full series of dicing blades (electroformed, resin, metal), precision grinding products (thinning wheels, ceramic chucks, etc.). Applications: integrated circuits, LED chips, optical components, new energy batteries, electronic ceramics, magnetic materials. Served thousands of enterprises across 30 provinces. Vision: Perseverance, proactiveness, harmonious work, self-transcendence; striving for innovation and precision.</p>
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