QSD0620

QSD0620

Supplier
Zzqsjm
Category
Semiconductor Manufacturing Equipment
Origin
China

6-inch dicing machine: QSD0620, QSD0630, QSD0636. Products suitable for processing by this equipment include silicon wafers, plastic packages (QFN, BGA, etc. ), PCB boards, ceramic substrates (alumina, zirconia, etc. ), oxide ceramics (heat-sensitive, pressure-sensitive, photoresistor), glass, quartz, lithium niobate, lithium tantalate, magnetic materials, etc

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Overview

6-inch dicing machine: QSD0620, QSD0630, QSD0636. Products suitable for processing by this equipment include silicon wafers, plastic packages (QFN, BGA, etc. ), PCB boards, ceramic substrates (alumina, zirconia, etc. ), oxide ceramics (heat-sensitive, pressure-sensitive, photoresistor), glass, quartz, lithium niobate, lithium tantalate, magnetic materials, etc

Specifications

ParameterValue
Processing SizeΦ6" 60X160mm
Speed Range5000-50000RPM
Power1.5KW
X Axis Dicing Speed0.01-400mm/s
Y Axis Method+
Y Axis Resolution0.0001mm
Y Axis Single-Step Accuracy0.002/5mm
Y Axis Cumulative Accuracy0.004/165mm
Z Axis0.001mm
T Axis MethodDD
T Axis Rotation Angle Range0-320°
T Axis Resolution0.0004°
T Axis Accuracy3"
Function Configuration· · · · · · Automatic ·NCS
Cutting Water0.2-0.4MPa: 3L/min
Cooling Water0.2-0.4MPa: 1.5L/min
Exhaust Air Volume1.5m³/min
Outline Dimensions640X908X1650mm
Processing SizeΦ6" 160X160mm
Speed Range5000-50000RPM
Power1.8KW
X Axis Dicing Speed0.01-400mm/s
Y Axis Method+
Y Axis Resolution0.0001mm
Y Axis Single-Step Accuracy0.002/5mm
Y Axis Cumulative Accuracy0.004/165mm
Z Axis0.001mm
T Axis MethodDD
T Axis Rotation Angle Range0-320°
T Axis Resolution0.0004°
T Axis Accuracy3"
Function Configuration· · · · · · Automatic ·NCS
Cutting Water0.2-0.4MPa: 3L/min
Cooling Water0.2-0.4MPa: 1.5L/min
Exhaust Air Volume1.5m³/min
Outline Dimensions640X908X1650mm
Processing SizeΦ6" 160X160mm
Speed Range5000-50000RPM
Power1.8KW
X Axis Dicing Speed0.01-400mm/s
Y Axis Method+
Y Axis Resolution0.0001mm
Y Axis Single-Step Accuracy0.002/5mm
Y Axis Cumulative Accuracy0.004/165mm
Z Axis0.001mm
T Axis MethodDD
T Axis Rotation Angle Range0-320°
T Axis Resolution0.0004°
T Axis Accuracy3"
Function Configuration· · · · · · Automatic ·NCS
Cutting Water0.2-0.4MPa: 3L/min
Cooling Water0.2-0.4MPa: 1.5L/min
Exhaust Air Volume1.5m³/min
Outline Dimensions640X908X1650mm
Dicing Straightness0.002mm/150mm
Worktable Flatness0.006mm/Φ150mm
X Y Axis Perpendicularity0.01mm/150mm
Y Axis Step Accuracy - Single-Step Accuracy0.002/5mm
Y Axis Step Accuracy - Full-Travel Cumulative Accuracy0.005/160mm
Spindle Flange Accuracy - Horizontal Direction0.002mm
Spindle Flange Accuracy - Vertical Direction0.002mm
Cutting Water1. Cutting Water ±2°C, 0.2-0.4MPa, 2 φ12mm, 205mm. 3 φ32mm, 460mm
Spindle Cooling Water1. Cooling Water ( Spindle ), ±2°C, 0.2-0.4MPa. 2. Cooling Water: φ8mm, 205mm
Mist Extraction PipeMist Extraction Pipe φ60mm, 1.5m³/min, 1120mm

Applications

(IC), (LED), Ceramic; Wafer, (QFN, BGA ), PCB Board, Ceramic (, ), Ceramic (, ), Glass, Quartz, Lithium Niobate, Material

Key Features

Integrated Unit, Y, Material

Datasheet

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Supplier Information

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Since its establishment in 2014, Qisheng Precision has always focused on the semiconductor and precision manufacturing industries, specializing in the research, development, and manufacturing of dicing equipment, superhard tools, and precision grinding products. It is one of the few high-tech enterprises in China that truly achieves dual-track independent research and development of "equipment + tools". Core Strengths ▪ Integrated R&D and Manufacturing: Established three major business divisions, building full-chain capabilities from equipment R&D, tool manufacturing to process support. ▪ R&D Team and Technical Accumulation: Possesses a professional R&D team, mastering core technologies such as precision transmission, material processing, and blade design. Core Products ▪ Precision Dicing Saw: High-precision cutting platform, suitable for cutting various hard and brittle materials. Full series of dicing blades: electroformed/resin/metal materials, covering various cutting scenarios. ▪ Precision Grinding Products: Thinning grinding wheels, ceramic chucks, dressing boards, custom flange plates, and other supporting consumables. Industry Applications Products are widely used in integrated circuits, LED chips, optical components, new energy batteries, electronic ceramics, magnetic materials, and other fields, supporting ultra-precision cutting and grinding of various materials such as silicon, gallium arsenide, ceramics, glass, and lithium niobate. Cooperation Recognition Products have served thousands of enterprises in over 30 provinces and cities across the country, including many listed companies and research institutions in the fields of semiconductor packaging and LED chip manufacturing, becoming an equipment and tool supplier in the rapid development of the industry. Vision and Mission Guided by the spirit of "perseverance, proactiveness, harmonious work, and self-transcendence", Qisheng Precision continues to innovate and strive for excellence, committed to continuously improving the precision and stability of cutting solutions through technological innovation, and helping Chinese manufacturing go global.

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