1625nm DFB Butterfly Laser Module (14 pins)
JUNTE Communication 1625nmLaser (DFB)
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Overview
JUNTE Communication 1625nmLaser (DFB), , . Laser Diode (MQW), . MQW DFBLaser High Output Power, Good Side-Mode Suppression Ratio(SMSR) Built-InThermoelectric Cooler, Thermistor Monitor Photodiode
Specifications
| Parameter | Value |
|---|---|
| Laser Chip Forward Current | Max 1200mA |
| Laser Chip Reverse Current | Max 2mA |
| Reverse Voltage (Laser diode) | Max 2V |
| Relative Humidity | Max 95% |
| TEC Voltage | Max 2V |
| Thermal Electric Cooler Current | Max 1.5A |
| Fiber Yield Strength | Max 30nm |
| Fiber Bend Radius | Max 1 |
| Monitor Detector Reverse Voltage | Max 15V |
| Monitor Detector Reverse Photo Current | Max 1mA |
| Monitor Detector Forward Current | Max 2mA |
| Relative Humidity | Max 80% |
| Bias Current | Max 70mA |
| Thermistor | 9.5~10.5, Typ 10 |
| TEC Cooler Current | Max 1000mA |
| Monitor Current | 10~150uA |
| Monitor Dark Current | Max 500nA |
| Wavelength Tolerance | ±5nm |
| Tracking Error (Delta Pf) | Max 0.5dB |
| Monitor PD Capacitance | Max 0.5pF |
| Connector Repeatability | Max 0.3dB |
| Tracking Error (Er) | Max 1dB |
| Rise Time/ Fall Time | Max 2.0ns |
Applications
Long-Reach Analog Transmission Systems; Light Source; Sensor; Optical Communication; Test Equipment
Key Features
High-Linearity Direct ModulationDFBLaser; High Output Power1~100mW; Built-In, TEC, Thermistor Monitor PD; 14 Hermetic Package; Compliant withRoHS
Datasheet
Product Datasheet
PDF
Supplier Information
<p>Xiamen Xianchuang Junte Communication Technology Co., Ltd. was established in October 2006. It is located in Xiang'an District, Xiamen City. Our company develops and provides optical components for aerospace, rail transit, security, gas detection, optical communications, test and measurement, fiber optic gyroscopes, fiber optic sensing, light sources, data centers, environmental monitoring, medical care, artificial intelligence, and military industries.</p><p><br></p><p>Günter has a systematic production chain, which covers chip design, TO-CAN production, coaxial structure packaging, butterfly packaging with TEC cooling (lasers, photodetectors 8PIN, 14PIN, DIL 14PIN, etc.).</p>
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