Stainless Steel Optical Breadboard HMBB Series

Specifications: 364.7 mm × 100.0 mm × 15.9 mm Port Type: 【 Female Connector 】Ø53.2mm,,α=60° Clear aperture: Ø38.1mm

MCB-series breadboards support custom widefield observation and epi-illumination paths above Oeabt microscopy systems. The breadboard has a Ø51mm male dovetail with a central Ø38.1mm through-hole for the imaging-system optical axis.

Specifications: 472.4 mm × 114.2 mm × 111.2 mm Slider Base [Thickness ≥4mm]: 45° Mounting of Ø2-Inch Optical Components with Thickness ≥4mm Slider Base: SM2 (2.035”-40) internal thread

The MPBX breadboard supports custom widefield observation setups and epi-illumination paths on top of Oeabt microscopic imaging systems and includes a dual-position slider mount.

Specifications: 150 mm × 125 mm × 6 mm Thread type: M4、M6 Threaded hole ，Ø4.2 Countersunk hole Spacing: Hole spacing 12.5mm or 25.0mm, edge spacing 12.5mm

OHD-6C-series breadboards are designed for space-limited setups. Constructed from 6mm-thick solid black-anodized aluminum, they greatly reduce surface reflections. Their small dimensions and thin profile suit confined areas or extensions to an optical assembly's work surface.

Flatness after vacuum holding a silicon wafer: ≤5um; heating time from 20℃ to 55℃: ≤30s; cooling time from 55℃ to 20℃: ≤55s; digital pressure reading during heating/cooling with a chip held: <-85Kpa; reading without a chip held: >-10Kpa.

Wavelength: 405nm~800nm, 2 to 3 optional lasers Power: 20 ~ 50mW RMS Noise (20Hz - 20MHz): < 0.1%

The BASOE optical engine incorporates 405nm/488nm/532nm/638nm lasers, or optional alternative wavelength bands, and an integrated beam-shaping module to deliver a focused beam meeting customer requirements to the flow cell. The integrated optical laser module uses built-in driver circuitry and patented technology to provide high stability, low coherence and low speckle, ensuring outstanding laser performance over time and temperature changes. Combined with an integrated SiPM detector signal-receiving module, it ensures batch consistency, greatly shortens instrument development cycles and accelerates customers' time to market.