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Working Area X Axis: 300mm/0.05um Working Area Y Axis: 300mm/0.05um Working Area Z Axis: 50mm/0.05um

The LASER X Module Wire Bonding Machine is a high-precision ultrasonic bonding system designed for power semiconductor module packaging. It features a direct-drive motion platform and on-the-fly vision system to maximize throughput, and a gantry XY platform that supports a large bonding area of 300mm x 300mm. The machine supports flexible switching between aluminum wire, aluminum ribbon and copper wire bonding heads, covering wire diameters from 4mil to 20mil (100um-500um) and ribbon sizes from 20x4mil to 80x10mil. With 60KHz or 80KHz ultrasonic transducers, motor-driven high-resolution encoder feedback wire feeding, online pull force testing, and a bonding cycle of less than 1 second, it delivers efficient, reliable and high-quality interconnection for power modules, battery packs and semiconductor devices.

Work Area X-axis: 60mm/0.1um Work Area Y-axis: 100mm/0.1um Work Area Z-axis: 55mm/0.05um

The LASER X XB-7024 is a fully automatic heavy wire bonding machine designed for power semiconductor packaging. Equipped with dual bonding heads, it supports ultrasonic bonding of thick aluminum wire (100um-500um) and aluminum ribbon, featuring programmable ultrasonic power at different bonding stages, real-time wire length detection, stable bonding force control, and online pull force testing. With a throughput of up to 8K/H for four-row TO252 devices, it delivers high efficiency and reliable interconnection quality for single-row to eight-row matrix power devices.

Supported Chip Types: 硅光，薄膜铌酸锂 Supported Product Forms: 蓝膜，单DIE，Bar条 Loading/Unloading Method: 全自动上下料

The Chip Coupling Test Machine is a fully automatic optical coupling and testing system designed for photonic chips such as silicon photonics and thin-film lithium niobate. It supports devices in blue film, single DIE and bar formats, and integrates high-precision automatic probing, linear motor coupling, automatic optical adhesive dispensing, needle cleaning, binning, OCR recognition and MES data upload. With a controllable temperature range of 25℃~80℃, optical coupling completed within 30s, coupling repeatability better than 0.2dB and optical power stability within 0.2dB@3min, it delivers efficient, accurate and stable testing for photonic chip R&D and mass production.

Placement Accuracy: ±5um @3 sigma; ±3um (Standard Die) Placement Angle Accuracy: ±0.3° @3 sigma Bonding Force: 10gf~200gf (Programmable)

The LASER X High-precision Automatic Die Bonder is a precision die bonding solution designed for multi-chip hybrid assembly of optical devices and sensors, including COB and BOX packages. It achieves placement accuracy of ±3um (standard die) and ±5um @3 sigma, supports automatic changeover of up to 4 nozzle types, and offers coexisting glue-dipping and glue-writing dispensing systems. With flexible material handling for up to four 6-inch expanded wafer rings, plus optional Waffle Pack, Gel-Pak, or custom fixtures, it provides a highly adaptable platform for advanced optoelectronic packaging.

Overall Dimensions: 58×0.15×40mm Outer Diameter: 58mm Thickness: 0.15mm

This product is an ultra-thin precision metal shim ring (flat annular spacer washer) with a gold-colored finish, marked by permanent laser engraving. According to the laser markings on the rings, the part number is H4Z1001-8, the serial numbers are 01-2-9115-L75 and 01-2-9116-L75, the batch code is 168170, and the overall dimension specification is 58×0.15×40mm, corresponding to an outer diameter of 58mm, a thickness of 0.15mm and an inner diameter of 40mm. Each ring carries an SD manufacturer marking and a unique serial code for full production traceability. With its precise, ultra-thin geometry, this type of shim ring is typically used for accurate spacing, alignment and gap adjustment in optical, opto-mechanical and laser module assemblies.