Special Metallized Ceramic Substrate
觉芯Email Side/Through-Hole Metallization,Precision Grooves/Special Ceramic Shapes for Communications,Semiconductors,High-Energy Particles,etc.
Specification Snapshot
Substrate Material
AlN, Al₂O₃, etc.
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Overview
觉芯Email Side/Through-Hole Metallization,Precision Grooves/Special Ceramic Shapes for Communications,Semiconductors,High-Energy Particles,etc.
Specifications
| Parameter | Value |
|---|---|
| Substrate Material | AlN, Al₂O₃, etc. |
| Pattern and Dimensions [Customizable to Customer Requirements] | Customizable to Customer Requirements, Side and Through-Hole Metallization Available |
| Metallization Layer [Customizable to Customer Requirements; Standard Film Structure and Thickness; Nom] | Standard Layer Structure and Thickness: Ti 0.1μm/Pt 0.2μm/Au 0.5μm (Nom); Other Layer Structures and Thicknesses Customizable to Customer Requirements |
| Special Shapes [Customizable to Customer Requirements] | Customizable to Customer Requirements, Surface/Side Grooves and Metallization of Special-Shaped Substrates Available |
Key Features
Preapplied AuSn Solder Available, Ratio and Thickness Customizable; Integrated Thin-Film Resistors Available
Datasheet
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Supplier Information
Juexin Electronics (Wuxi) Co., Ltd. is located in Huanghu Industrial Park, Xinwu District, Wuxi. The company specializes in R&D and industrialization of optoelectronic components, photoelectric detection and machine vision equipment, optical MEMS chips and modules, serving fields such as scientific research, IoT, advanced industrial processing, consumer electronics, 5G communication, smart home, and autonomous driving. It has advanced thin-film deposition systems, ultrasonic cleaning, high-precision patterning platforms, and has passed ISO9001 quality management certification. The experienced team provides high-performance optical components, laser thin-film devices, metallized ceramic substrates, MEMS chips and modules, and customized services.
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