NDW4115
The NDW4115 is a silicon avalanche photodiode chip with high operation frequency and high multiplication gain. High-Gain APD for Weak Light,Handheld/Scope Ranging,LiDAR,Medical Analysis;Precise Cost-Effective Molded Package without Filter;NBTech Co-Packable/Arrayable Chips,Developing Array/Quadrant/Special Shapes.
Specification Snapshot
Chip Dimensions [APD Chip; Parameter Image 04 Independent Selection Table]
1.00 mm × 1.00 mm
Photosensitive Region [APD Chip; Parameter Image 04 Independent Selection Table]
Φ500
Photosensitive Wavelength [APD Chip; Parameter Image 04 Independent Selection Table; Parenthesized Wavelength Has No Original Explanation and Is Not Assumed to Be a Peak]
400~1050nm(860nm)
Forward Current I_F [MAXIMUM RATINGS;Ta=25°C]
1 mA
Chip size [Independent Technical Name/Value Table on Page 1]
1000 μm × 1000 μm
Chip thickness [Independent Technical Name/Value Table on Page 1]
250 μm
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Overview
The NDW4115 is a silicon avalanche photodiode chip with high operation frequency and high multiplication gain.
High-Gain APD for Weak Light,Handheld/Scope Ranging,LiDAR,Medical Analysis;Precise Cost-Effective Molded Package without Filter;NBTech Co-Packable/Arrayable Chips,Developing Array/Quadrant/Special Shapes.
Specifications
| Parameter | Value |
|---|---|
| Chip Dimensions [APD Chip; Parameter Image 04 Independent Selection Table] | 1.00 mm × 1.00 mm |
| Photosensitive Region [APD Chip; Parameter Image 04 Independent Selection Table] | Φ500 |
| Reverse Breakdown Voltage V_BR [APD Chip; Parameter Image 04 Independent Selection Table] | 120~160 V |
| Photosensitive Wavelength [APD Chip; Parameter Image 04 Independent Selection Table; Parenthesized Wavelength Has No Original Explanation and Is Not Assumed to Be a Peak] | 400~1050nm(860nm) |
| Forward Current I_F [MAXIMUM RATINGS;Ta=25°C] | 1 mA |
| Peak Reverse Current I_R [MAXIMUM RATINGS;Ta=25°C] | 0.25 mA |
| Junction Temperature T_J [MAXIMUM RATINGS;Ta=25°C] | 150 °C |
| Chip size [Independent Technical Name/Value Table on Page 1] | 1000 μm × 1000 μm |
| Chip thickness [Independent Technical Name/Value Table on Page 1] | 250 μm |
| Passivation [Independent Technical Name/Value Table on Page 1] | Silicon Nitride |
| Top metal [Independent Technical Name/Value Table on Page 1] | AL |
| Bottom metal [Independent Technical Name/Value Table on Page 1] | AgNi |
| Bonding pad (Top) [Independent Technical Name/Value Table on Page 1; Top] | CathodeΦ100μm |
| Bonding pad (Bottom) [Independent Technical Name/Value Table on Page 1; Bottom] | Anode |
| Avalanche Voltage [Independent Features on Page 1] | 120~160 V |
| Spectral Response Range λ [Electro-optical characteristics;Ta=25°C;M=1] | min:400 nm; max:1050 nm |
| Peak Response Wavelength λ_P [Electro-optical characteristics;Ta=25°C] | typical:860 nm |
| Responsivity Re [Electro-optical characteristics; Ta=25°C; λ=905 (no unit specified in the source); M=100] | typical:55 A/W |
| Reverse Breakdown Voltage V_BR [Electro-optical characteristics;Ta=25°C;I_R=100μA] | min:120 V; max:160 V |
| Breakdown-Voltage Temperature Coefficient δ [Electro-optical characteristics;Ta=25°C] | typical:1.4 V/°C |
| Dark Current I_D [Electro-optical characteristics;Ta=25°C;M=100] | typical:0.6 nA; max:2 nA |
| Response Time ts [Electro-optical characteristics;Ta=25°C;M=100;R_L=50Ω;λ=800nm] | typical:0.35 ns |
| Capacitance C [Electro-optical characteristics;Ta=25°C;M=100;f=1MHz] | typical:2.2 pF |
| Cutoff Frequency f_C [Electro-optical characteristics;Ta=25°C;M=100;R_L=50Ω;λ=800nm;-3dB] | typical:1 GHz |
| Amplification Factor M [Electro-optical characteristics;Ta=25°C] | Typ:100 |
| Active Area Diameter [Independent Features / Name-Value Table on PDF Page 1] | 500 μm |
Applications
Laser Ranging, Telescopes, LIDAR, Low-Light Detection; Handheld Ranging, Rangefinding Telescopes, LIDAR and Medical Analysis
Key Features
Silicon Avalanche Photodiode;Response400~1050nm;Active Areaø120um;PDF Active AreaΦ500μm(Page1 Features/Technical Table;Retained Separately from Current HTML SourceΦ120μm);Avalanche Voltage120V~160V
635nm,650nm,905nm Avalanche Diodes;Fast Response,Low Dark Current;Molded/Ceramic Packages(with Filter);Custom Arrays;Molded APDs Have No Filter,Precise Dimensions and Good Cost Performance;APD Chips Can Be Copackaged/Arrayed;Array,Quadrant and Other Irregular APD Chips Under Development
Datasheet
Product Datasheet
PDF
Supplier Information
Shanghai Enbi Technology Co., Ltd., founded in 2016, focuses on optoelectronic technology R&D and production. Based on optoelectronic semiconductor discrete devices, it integrates optics, MEMS, electronics, microelectronics, semiconductor optoelectronic IC technologies, covering components, optoelectronic ICs, sensor modules, with full capability from chip design to module mass production, holding independent IP and unique testing systems. The company has an excellent management team and skilled staff, rich industry experience, strong R&D, efficient mass production and strict quality control, providing high-performance, reliable, cost-effective products; for special applications, we offer optimal optoelectronic solutions and custom products. Since its establishment, the company insists on independent innovation, quality first, continuously launching innovative products widely used in industrial equipment, automotive electronics, laser ranging, healthcare, instrumentation, security monitoring, smart home, etc., with performance replacing high-end foreign brands. Enbi Technology actively deploys in IoT, intelligent society, AI, driving industry upgrades, aiming to become a high-end optoelectronic brand.
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