6000W Hybrid Laser Welding System CSW50
Save to Favorites
Specifications
| Parameter | Value |
|---|---|
| Fiber Interface | Standard QBH |
| Laser Wavelength | 1064nm+450nm/915nm/980nm |
| Laser Power | ≤6000W |
| Focusing Lens [1064nm] | D25.4 F200/F250/F300 @1064nm |
| Collimating Lens [915nm/980nm/450nm] | D50 F90 @915nm/980nm/450nm |
| Focused Spot | 0.05~1.5 mm |
| Cooling Method | Water Cooling |
| Gas Circuit | Supported |
| Illumination | Side-Emitting Light |
| Welding Width | ≤10 mm |
| Oscillation Frequency | ≤500 Hz |
| Oscillation Accuracy | 0.01 mm |
| Shielding Gas | Side Blowing / Coaxial / Air Knife |
| Drive and Control Method | Integrated |
| Control Interface | DB25 |
| Interference Immunity | Strong Interference Immunity |
| HMI | 2.8-Inch Resistive Touchscreen |
| Laser Control | Supported |
| Automation | Supported |
| Scanning Path | Point / Line / Circle / Rectangle / 8 / Spiral / Annular Wobble |
| Observation CCD | Supported |
| Operating Temperature | +15℃ to +35°C |
| Humidity [Non-Condensing] | <80%, Non-Condensing |
| Weight | 7.5Kg |
Key Features
Datasheet
Please provide your email to download the datasheet.
Invalid email format. Please try again.
Supplier Information
Related Products
-
Open Single Table Sheet Laser Cutting Machine BLS3015
Laser Processing Equipment
Auroralaser
Working Area: 3000*1500 Table Load Bearing: 2000 kg Overall Dimensions: 4850 mm × 2330 mm × 1920 mm
BLS Series Open Single Table Sheet Laser Cutting Machine The “single table” and “open-frame” design are ideal solutions for sheet metal processing scenarios that prioritize cost-effectiveness, operational convenience, and flexible adaptability.
-
Open Single Table Sheet Laser Cutting Machine BLS4015
Laser Processing Equipment
Auroralaser
Working Area: 4000*1500 Table Load Bearing: 2500 kg Overall Dimensions: 5850 mm × 2330 mm × 1920 mm
BLS Series Open Single Table Sheet Laser Cutting Machine The “single table” and “open-frame” design are ideal solutions for sheet metal processing scenarios that prioritize cost-effectiveness, operational convenience, and flexible adaptability.
-
Open Single Table Sheet Laser Cutting Machine BLS6015
Laser Processing Equipment
Auroralaser
Working Area: 6000*1500 Table Load Bearing: 3500 kg Overall Dimensions: 7920 mm × 2330 mm × 1920 mm
BLS Series Open Single Table Sheet Laser Cutting Machine The “single table” and “open-frame” design are ideal solutions for sheet metal processing scenarios that prioritize cost-effectiveness, operational convenience, and flexible adaptability.
-
Open Single Table Sheet Laser Cutting Machine BLS6020
Laser Processing Equipment
Auroralaser
Working Area: 6000*2000 Table Load Bearing: 5000 kg Overall Dimensions: 7920 mm × 2880 mm × 1920 mm
BLS Series Open Single Table Sheet Laser Cutting Machine The “single table” and “open-frame” design are ideal solutions for sheet metal processing scenarios that prioritize cost-effectiveness, operational convenience, and flexible adaptability.
-
Laser Cutting
Laser Processing Equipment
Jmwafer
Laser cutting is a precise, noncontact process widely used in advanced wafer-semiconductor manufacturing. A focused high-energy beam locally melts or vaporizes material through photothermal effects. Wavelength, power and pulse width are adjusted to material properties for optimal cuts. 晶沐光电 has its own laser-processing line with UV/ultrafast lasers, wafer infrared stealth-dicing and cleaving machines, infrared fiber cutting machines and other equipment for varied wafer-cutting needs.
Related Articles
VCSEL, short for Vertical Cavity Surface Emitting Laser, is a widely used semiconductor laser component in modern optoelectronics. Unlike traditional edge-emitting lasers, VCSEL emits laser light vertically from its chip surface. Thanks to its low power consumption, stable beam quality, low cost, and easy integration, it has become the core light source for 3D sensing, wearable devices, and high-speed optical communication.
As fundamental refractive optical components, plano‑convex spherical lenses consist of one convex spherical surface and one flat surface.
FiDAR, the fiber‑optic radar vehicle positioning and tracking system developed by Jianhe Bafang, is a high‑sensitivity distributed fiber‑sensing solution designed for intelligent traffic road monitoring. It outputs real‑time spatial coordinates of every vehicle across the full road section around‑the‑clock, delivering a brand‑new sensing technology for vehicle‑road cooperation, smart highway construction and urban traffic management.
Raybowlaser, a professional manufacturer of high-power laser chips, has officially launched its upgraded new-generation 1470nm high-performance laser chip. Achieving groundbreaking progress in rated output power and wall-plug efficiency (WPE), this innovative laser chip delivers superior and reliable core light source solutions for medical cosmetology, industrial processing, agricultural applications and scientific research equipment.
Loading...
Name
Phone
Organization
Use Case
Database Platform