Fully Automatic 3D Defect Inspection Equipment L3D-A40
LW3DC40 Deep Learning without Manual Programming,Submicrometre3D Inspection,Millisecond Scans,Various Workpieces,Smart Weld/Defect Recognition,Semiconductor/PCB Lines,Detection up to99.5%.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Imaging Camera | One 25-Megapixel CMOS; Four 5-Megapixel CMOS |
| Main Camera 2D Image - Resolution | 5120x5120 |
| Main Camera 2D Image - Data Spacing | 7.8μm |
| Side Camera 2D Image - Resolution | 2448x2048 |
| Side Camera 2D Image - Data Spacing | 22μm |
| 3D Point-Cloud Resolution | 2560x2560(1280x1280) |
| Field of View | 40mmx40mm |
| Measuring Range (Z Direction) | ±15mm |
| Working Distance | 80mm |
| Absolute Measurement Accuracy | ±1μm |
| Repeat Measurement Accuracy | ≤0.08μm |
| Image-Acquisition Speed | 0.2s |
| Light Source | 45° White Light & Coaxial Blue Light |
| Imaging Direction | 5 Directions |
| Automatic Programming Time | Less Than 13 Minutes |
| CAD File Import | Mainstream CAD File Import Supported |
| Detection Type | Missing Component, Wrong Component, Misalignment, Reversed Polarity, Tombstoning, Flipping, Excessive Height, Lifted Lead, Poor Solder Joint, Bridging, Damaged Component, Foreign Material, Excess Solder, Insufficient Solder, Scratch, Solder Connection, Open Solder Joint, Insufficient Soldering |
Applications
Datasheet
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Supplier Information
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