100 or 200GHz OADM (ITU Grid Wavelengths)
Specification Snapshot
Channels [Specifications;parts without connectors;200GHz;4 Channels]
4
Bandwidth [Specifications;parts without connectors;200GHz;4 Channels;@0.5dB]
min:0.5 nm
Insertion Loss [Specifications;parts without connectors;200GHz;4 Channels;In→Drop;@λ-drop;23°C;All SOP]
typical:2.5 dB
Insertion Loss [Specifications;parts without connectors;200GHz;4 Channels;Add→Out;@λ-add;23°C;All SOP]
typical:2.5 dB
Insertion Loss [Specifications;parts without connectors;200GHz;4 Channels;In→Out;@λ-other;23°C;All SOP]
typical:2.5 dB
Channels [Specifications;parts without connectors;200GHz;8 Channels]
8
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Specifications
| Parameter | Value |
|---|---|
| Channel Spacing [Specifications;parts without connectors;200GHz;4 Channels] | 200 GHz |
| Channels [Specifications;parts without connectors;200GHz;4 Channels] | 4 |
| Wavelength [Specifications;parts without connectors;200GHz;4 Channels] | ITU Grid |
| Bandwidth [Specifications;parts without connectors;200GHz;4 Channels;@0.5dB] | min:0.5 nm |
| Insertion Loss [Specifications;parts without connectors;200GHz;4 Channels;In→Drop;@λ-drop;23°C;All SOP] | typical:2.5 dB |
| Insertion Loss [Specifications;parts without connectors;200GHz;4 Channels;Add→Out;@λ-add;23°C;All SOP] | typical:2.5 dB |
| Insertion Loss [Specifications;parts without connectors;200GHz;4 Channels;In→Out;@λ-other;23°C;All SOP] | typical:2.5 dB |
| Package Dimension [Specifications;parts without connectors;200GHz;4 Channels] | 130 mm × 87 mm × 13 mm |
| Channel Spacing [Specifications;parts without connectors;200GHz;8 Channels] | 200 GHz |
| Channels [Specifications;parts without connectors;200GHz;8 Channels] | 8 |
| Wavelength [Specifications;parts without connectors;200GHz;8 Channels] | ITU Grid |
| Bandwidth [Specifications;parts without connectors;200GHz;8 Channels;@0.5dB] | min:0.5 nm |
| Insertion Loss [Specifications;parts without connectors;200GHz;8 Channels;In→Drop;@λ-drop;23°C;All SOP] | typical:3.0 dB |
| Insertion Loss [Specifications;parts without connectors;200GHz;8 Channels;Add→Out;@λ-add;23°C;All SOP] | typical:3.0 dB |
| Insertion Loss [Specifications;parts without connectors;200GHz;8 Channels;In→Out;@λ-other;23°C;All SOP] | typical:4.5 dB |
| Package Dimension [Specifications;parts without connectors;200GHz;8 Channels] | 133.5 mm × 96 mm × 15 mm |
| Channel Spacing [Specifications;parts without connectors;100GHz;4 Channels] | 100 GHz |
| Channels [Specifications;parts without connectors;100GHz;4 Channels] | 4 |
| Wavelength [Specifications;parts without connectors;100GHz;4 Channels] | ITU Grid |
| Bandwidth [Specifications;parts without connectors;100GHz;4 Channels;@0.5dB] | min:0.2 nm |
| Insertion Loss [Specifications;parts without connectors;100GHz;4 Channels;In→Drop;@λ-drop;23°C;All SOP] | typical:2.5 dB |
| Insertion Loss [Specifications;parts without connectors;100GHz;4 Channels;Add→Out;@λ-add;23°C;All SOP] | typical:2.5 dB |
| Insertion Loss [Specifications;parts without connectors;100GHz;4 Channels;In→Out;@λ-other;23°C;All SOP] | typical:2.5 dB |
| Package Dimension [Specifications;parts without connectors;100GHz;4 Channels] | 130 mm × 87 mm × 13 mm |
| Channel Spacing [Specifications;parts without connectors;100GHz;8 Channels] | 100 GHz |
| Channels [Specifications;parts without connectors;100GHz;8 Channels] | 8 |
| Wavelength [Specifications;parts without connectors;100GHz;8 Channels] | ITU Grid |
| Bandwidth [Specifications;parts without connectors;100GHz;8 Channels;@0.5dB] | min:0.2 nm |
| Insertion Loss [Specifications;parts without connectors;100GHz;8 Channels;In→Drop;@λ-drop;23°C;All SOP] | typical:3.0 dB |
| Insertion Loss [Specifications;parts without connectors;100GHz;8 Channels;Add→Out;@λ-add;23°C;All SOP] | typical:3.0 dB |
| Insertion Loss [Specifications;parts without connectors;100GHz;8 Channels;In→Out;@λ-other;23°C;All SOP] | typical:4.5 dB |
| Package Dimension [Specifications;parts without connectors;100GHz;8 Channels] | 133.5 mm × 96 mm × 15 mm |
| Ripple [Specifications; Parts Without Connectors; Source Explicitly Specifies Min, Not Changed to Max.] | min:0.5 dB |
| Isolation [Specifications;parts without connectors;In→Out;@λ-drop;23°C;All SOP] | min:25 dB |
| Isolation [Specifications;parts without connectors;Adjacent Channel;23°C;All SOP] | min:25 dB |
| Isolation [Specifications;parts without connectors;Non-adjacent Channel;23°C;All SOP] | min:40 dB |
| Uniformity [Specifications;parts without connectors] | max:1.0 dB |
| PDL [Specifications;parts without connectors] | max:0.1 dB |
| PMD [Specifications;parts without connectors] | max:0.1 ps |
| Return Loss [Specifications;parts without connectors] | min:45 dB |
| Directivity [Specifications;parts without connectors] | min:50 dB |
| Optical Power Handling [Specifications;parts without connectors] | max:300 mW |
| Operation Temperature [Specifications;parts without connectors] | 0 to60 °C |
| Storage Temperature [Specifications;parts without connectors] | -40 to85 °C |
| Connector impact [Footnote; not quantified] | Adding connectors can affect IL, RL, & PDL |
| SOP [footnote] | State Of Polarization |
| Channel Spacing [Ordering Information;OADM prefix] | 2=200GHz;1=100GHz |
| Channels [Ordering Information;OADM prefix] | 2=2-Ch;4=4-Ch;8=8-Ch;X=Others |
| Add/Drop Wavelength [Ordering Information;OADM prefix] | 21=ITU21;22=ITU22;23=ITU23;X=Others |
| Fiber Type [Ordering Information;OADM prefix] | B=SMF-28,250um;L=SMF-28,900um;H=SMF-28,3mm;X=Others |
| Fiber Length [Ordering Information;OADM prefix] | 10=1.0m;15=1.5m;20=2.0m;30=3.0m;X=Others |
| Connector [Ordering Information;OADM prefix] | NE=None;FA=FC/APC;FC=FC/PC;SA=SC/APC;SC=SC/PC;ST=ST/PC;LA=LC/APC;LC=LC/PC;X=Others |
Datasheet
Product Datasheet
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Supplier Information
Yantai Hengyan Photonics is a technology company focusing on invention and creation, founded by Chinese-American Dr. Liang Shaohua. The technical team has more than ten years of experience in product development and production, mainly manufacturing passive optical crystal devices and sensing equipment. The products are applied in fields such as optical fiber communication, medical testing, and environmental detection. It has applied for multiple patents and been authorized by the national intellectual property rights. The company provides employees with ample space to realize their value and ensures their interests. It is also responsible to customers, providing not only products but also professional design and technical support services, committed to long-term cooperation with enterprises and domestic and international universities and colleges. Yantai Hengyan Photonics is developing and attracting more talents, striding towards higher technology and industrialization.
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