Bessel Cutting Head BCH-D10-1030-1080-1.5
Bessel beams, also called nondiffracting beams, have a transverse “guangchang” distribution (source wording) unchanged during propagation. Main-lobe diameters can be a few micrometers and focal depths several millimeters. Low chipping, no taper, high efficiency, and high surface finish suit cutting, drilling, and grooving brittle materials such as glass, ceramics, and sapphire. With suitable picosecond pulse energy, strengthened glass separates automatically along the scan path without external force, simplifying processing and improving cutting efficiency. Unrestricted cutting shapes improve adaptability and flexibility. Bessel beams are a type of laser beam created by interference over a long distance, allowing an intense concentration of energy that can propagate without diffraction inside transparent materials. Bessel beams generated with an USP allow a deep ablation of the irradiated material, which is particularly useful for drilling nano-channels with high aspect ratios. It is thus possible to drill into glass layers that are several mm thick with very small diameters (less than 2 micrometers) and having a largely homogenous shape.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Wavelength [Model=BCH-D10-1030-1080-1.5] | 1030–1080 nm |
| Maximum Cutting Depth Input [Model=BCH-D10-1030-1080-1.5; Source Chinese Column Name Contains "Input", English Label Max Cutting Depth] | 1.5 mm |
| Input Aperture 1/e² [Model=BCH-D10-1030-1080-1.5] | 10 mm |
| Working Distance WD [Model=BCH-D10-1030-1080-1.5] | 17 mm |
| Focal Spot Size [Model=BCH-D10-1030-1080-1.5] | 3 µm |
| Lens length [Model=BCH-D10-1030-1080-1.5] | 298 mm |
| Wavefront error | <1/10 λ |
| Transmittance | >97 % |
| Cuttable Glass Thickness | 1–3 mm |
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Datasheet
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