Basalt series RF matching units
The RF matching unit bridges impedance mismatches in RF power systems. By monitoring reflected power and dynamically adjusting an internal matching network, it creates an impedance path between a changing plasma load and the supply. Minimizing reflections ensures efficient, stable plasma-power absorption and supports process repeatability and equipment safety.
Specification Snapshot
Power [Configuration in this row: Operating frequency 450kHz; Power 1500W; Options within the same power cell share this row's cooling/dimensions, not independent models]
1500 W
Dimensions [Configuration in this row: Operating frequency 450kHz; Power 1500W; Options within the same power cell share this row's cooling/dimensions, not independent models]
130mm (width) 372mm (height) 240mm (depth)
Power [Configuration in this row: Operating frequency 40.68MHz; Power 10000W; Options within the same power cell share this row's cooling/dimensions, not independent models]
10000 W
Dimensions [Configuration in this row: Operating frequency 40.68MHz; Power 10000W; Options within the same power cell share this row's cooling/dimensions, not independent models]
251mm (width) 480mm (height) 253mm (depth)
Power [Configuration in this row: Operating frequency 13.56MHz; Power 3000W; Options within the same power cell share this row's cooling/dimensions, not independent models]
3000 W
Dimensions [Configuration in this row: Operating frequency 13.56MHz; Power 3000W; Options within the same power cell share this row's cooling/dimensions, not independent models]
330mm (width) 223mm (height) 261mm (depth)
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Overview
The RF matching unit bridges impedance mismatches in RF power systems. By monitoring reflected power and dynamically adjusting an internal matching network, it creates an impedance path between a changing plasma load and the supply. Minimizing reflections ensures efficient, stable plasma-power absorption and supports process repeatability and equipment safety.
Specifications
| Parameter | Value |
|---|---|
| Operating Frequency [Configuration in this row: Operating frequency 450kHz; Power 1500W; Options within the same power cell share this row's cooling/dimensions, not independent models] | 450 kHz |
| Power [Configuration in this row: Operating frequency 450kHz; Power 1500W; Options within the same power cell share this row's cooling/dimensions, not independent models] | 1500 W |
| Cooling Method [Configuration in this row: Operating frequency 450kHz; Power 1500W; Options within the same power cell share this row's cooling/dimensions, not independent models] | Air Cooling |
| Dimensions [Configuration in this row: Operating frequency 450kHz; Power 1500W; Options within the same power cell share this row's cooling/dimensions, not independent models] | 130mm (width) 372mm (height) 240mm (depth) |
| Communication Interface [Configuration in this row: Operating frequency 450kHz; Power 1500W; Options within the same power cell share this row's cooling/dimensions, not independent models] | RS232/485 |
| Communication Interface (Optional) [Configuration in this row: Operating frequency 450kHz; Power 1500W; Options within the same power cell share this row's cooling/dimensions, not independent models] | EtherCAT |
| Operating Frequency [Configuration in this row: Operating frequency 40.68MHz; Power 10000W; Options within the same power cell share this row's cooling/dimensions, not independent models] | 40.68 MHz |
| Power [Configuration in this row: Operating frequency 40.68MHz; Power 10000W; Options within the same power cell share this row's cooling/dimensions, not independent models] | 10000 W |
| Cooling Method [Configuration in this row: Operating frequency 40.68MHz; Power 10000W; Options within the same power cell share this row's cooling/dimensions, not independent models] | Air Cooling |
| Dimensions [Configuration in this row: Operating frequency 40.68MHz; Power 10000W; Options within the same power cell share this row's cooling/dimensions, not independent models] | 251mm (width) 480mm (height) 253mm (depth) |
| Communication Interface [Configuration in this row: Operating frequency 40.68MHz; Power 10000W; Options within the same power cell share this row's cooling/dimensions, not independent models] | RS232/485 |
| Communication Interface (Optional) [Configuration in this row: Operating frequency 40.68MHz; Power 10000W; Options within the same power cell share this row's cooling/dimensions, not independent models] | EtherCAT |
| Operating Frequency [Configuration in this row: Operating frequency 13.56MHz; Power 3000W; Options within the same power cell share this row's cooling/dimensions, not independent models] | 13.56 MHz |
| Power [Configuration in this row: Operating frequency 13.56MHz; Power 3000W; Options within the same power cell share this row's cooling/dimensions, not independent models] | 3000 W |
| Cooling Method [Configuration in this row: Operating frequency 13.56MHz; Power 3000W; Options within the same power cell share this row's cooling/dimensions, not independent models] | Air Cooling |
| Dimensions [Configuration in this row: Operating frequency 13.56MHz; Power 3000W; Options within the same power cell share this row's cooling/dimensions, not independent models] | 330mm (width) 223mm (height) 261mm (depth) |
| Communication Interface [Configuration in this row: Operating frequency 13.56MHz; Power 3000W; Options within the same power cell share this row's cooling/dimensions, not independent models] | RS232/485 |
| Operating Frequency [Configuration in this row: Operating frequency 13.56MHz; Power 6000W; Options within the same power cell share this row's cooling/dimensions, not independent models] | 13.56 MHz |
| Power [Configuration in this row: Operating frequency 13.56MHz; Power 6000W; Options within the same power cell share this row's cooling/dimensions, not independent models] | 6000 W |
| Cooling Method [Configuration in this row: Operating frequency 13.56MHz; Power 6000W; Options within the same power cell share this row's cooling/dimensions, not independent models] | Air Cooling |
| Dimensions [Configuration in this row: Operating frequency 13.56MHz; Power 6000W; Options within the same power cell share this row's cooling/dimensions, not independent models] | 300mm (width) 362mm (height) 379mm (depth) |
| Communication Interface [Configuration in this row: Operating frequency 13.56MHz; Power 6000W; Options within the same power cell share this row's cooling/dimensions, not independent models] | RS232/485 |
| Communication Interface (Optional) [Configuration in this row: Operating frequency 13.56MHz; Power 6000W; Options within the same power cell share this row's cooling/dimensions, not independent models] | EtherCAT |
| Frequency Range [Frequency range in product features, not the operating frequency of individual row configurations] | 400kHz, 1MHz, 2MHz, 13.56MHz, 27.12MHz, 40.68MHz, 60MHz, 200kHz, etc. |
Applications
MEMS; flat-panel displays; etching; chemical vapor deposition; atomic layer deposition; physical vapor deposition.
Key Features
Selectable single-frequency, dual-frequency mixed single-output, dual-output, manual, or automatic operation; frequencies including 400kHz, 1MHz, 2MHz, 13.56MHz, 27.12MHz, 40.68MHz, 60MHz, and 200kHz; L, T, π, Gamma (Γ), and other matching topologies for frequencies such as 13.56MHz and 400kHz; a broad impedance range for complex load changes. Built-in V/I Sensor monitors input/load impedance, voltage, and current for fast automatic matching and chamber-load monitoring. A closed-loop stepper drives vacuum capacitors, with alarm monitoring and compensation for precise positioning. Mixing and synchronous demodulation resolve dual-frequency impedance data for advanced controls such as multifrequency coordination and endpoint detection. Fully digital measurement/control combines precise impedance measurement and intelligent algorithms for stable, rapid matching; at a suitable ±10% preset position, SMA matching is <200ms. Intelligent algorithms identify input frequency within center frequency ±5% and impedance for broadband automatic matching with wider frequency and impedance choices. RF detection supports single-, dual-, and four-level pulses, analyzes single/multilevel pulse data, and automatically matches single pulses or the highest-power level of multilevel pulses.
Datasheet
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Supplier Information
Shenzhen CSL Vacuum Technology Co., Ltd. is a leading domestic supplier of core components for large-scale integrated circuit wafer front-end thin film deposition, plasma etching, lithography, photoresist stripping, ion implantation, and bonding equipment. The company is mainly engaged in the R&D, production, sales, and technical services of plasma RF power supply systems, plasma excitation devices, plasma DC power supplies, and various accessories. It also introduces core components related to vacuum acquisition and fluid control, providing overall solutions for core components around plasma processes.
The company is a domestically technologically leading enterprise in plasma RF power supply systems that has achieved mass product delivery. Its products have been delivered in batches to leading domestic equipment manufacturers such as Piotech, AMEC, NAURA, Leadmicro, and ACM Research, and are also supplied to leading domestic wafer fabs.
Founded in March 2013 and headquartered in Bao'an District, Shenzhen, the company has obtained ISO9001 and ISO14001 certifications. It is a national key "Little Giant" enterprise with specialized and sophisticated technologies, a national "Little Giant" enterprise, a council member of the China Integrated Circuit Component Innovation Alliance, a national high-tech enterprise, a "Kechuang China" RF switching power supply innovation base, a 2024 Guangdong Province Manufacturing Single Champion, and a Guangdong Province RF Switching Power Supply Engineering Technology Research Center. It has also won the 6th China Integrated Circuit Innovation Alliance "IC Innovation Award", the first prize of Guangdong Province Vacuum Science and Technology Progress Award, the "Core Component Innovation Award" of the 2024 "Bay Chip Award", SMIC's "Component Module Strategic Supplier", Piotech's "Outstanding Partner Award" and "Best Delivery Award", and Leadmicro's "Best Cooperation Award", among other honors.
The company will continue to be committed to the R&D and production of core components for semiconductor equipment, providing customers with comprehensive integrated solutions, fulfilling social responsibilities, deeply cultivating the industry, demonstrating responsibility, and contributing to the high-quality development of the national integrated circuit equipment industry.
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