HAD3610 precision abrasive-wheel dicing machine

HAD3610 precision abrasive-wheel dicing machine

Supplier
Syhanway
Part Number
HAD3610
Category
Semiconductor Packaging Equipment
Origin
China
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Specifications

ParameterValue
Larger workpiece size (round) [Circular workpiece]ø 12"
Larger workpiece size (square) [Square workpiece]300mm×300mm
X axis - Cuttable range310 mm
X axis - Feed-speed input range0.1 - 600 mm/s
Y axis*2 - Cuttable range310 mm
Y axis*2 - Single-step increment0.0001 mm
Positioning Accuracy [Y axis *2; /310]Within 0.003
Positioning Accuracy [Y axis *2; /5]Within 0.002
Z axis*2 - Effective travel40 mm
Z axis*2 - Repeatability0.001 mm
θ axis - Larger rotation angle380 Deg
θ axis - Rotation-angle accuracy15 ″
Spindle*2 - Rated output power2.4at 30,000 min-1
Spindle*2 - Rotational speed3000-60000 rpm
Function modules - Automatic alignmentAvailable
Function modules - Non-contact height measurementAvailable
Function modules - Blade-breakage detectionOptional
Function modules - In-line blade sharpeningAvailable
Basic specifications - Equipment dimensions (W × D × H)1080 × 1020 × 1,800
Basic specifications - Equipment weightApproximately 1500
Ambient Operating Temperature20~25℃
Operating-environment temperature fluctuationWithin ±1℃
Ambient Operating Humidity [Indoors; Non-condensing]<80%
Compressed-air dew point [Atmospheric pressure; Clean compressed air]-15℃ or below
Compressed-air residual oil content0.1ppm
Compressed-air filtration degree0.01um/99.5 or above
Cutting-water temperatureRoom temperature +2℃
Cutting-water temperature fluctuationWithin ±1℃
Cooling Water TemperatureSame as room temperature
Cooling-water temperature fluctuationWithin ±1℃
Installation-environment clearanceAvoid heavy impacts and external vibration; Do not install near blowers, ventilation outlets, high-temperature equipment or oily equipment
Installation floor and drainageWaterproof floor with unobstructed drainage

Applications

12-inch silicon wafers, large LED packages, QFN, DFN, BGA, optics/optoelectronics, communications, PCB, ceramics, glass, lithium niobate, alumina, quartz, and similar materials.

Key Features

Two imported 2.4KW high-power, high-torque air spindles as standard; noncontact height sensing (NCS); optional blade-breakage detection (BBD); a direct-drive DD θ-axis motor for high accuracy and speed; high-speed image recognition, multiple alignment modes, and rapid dicing-street location to save time and improve efficiency.

Datasheet

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Supplier Information

Sy
Syhanway
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Shenyang Hanway Technology Co., Ltd. is located at No. 19, Hunnan East Road, Hunnan New District, Shenyang City. It is a high-tech company mainly engaged in the R&D, sales, and service of semiconductor special equipment and accessories. With a technical team, product technology, and rich industry experience, it has a broad user base in various regions and provides reasonable and practical product solutions for customers. Hanway Technology focuses on the field of precision dicing and grinding of semiconductor materials. It produces HAD1600 series, HAD2600 series, HAD1800 series, and HAD3310 series precision dicing saws. Suitable for precision cutting of silicon, ceramics, PCB boards, EMC, quartz, glass, gallium arsenide, lithium niobate, and other materials, widely used in IC integrated circuits, discrete devices, LED packaging, optical communication devices, NTC, MEMS, photovoltaics, medical devices, scintillation crystals, and other industries. Customer demand is our work goal, and customer satisfaction is our direction! Shenyang Hanway Technology Co., Ltd. will continue to strive to provide customers with good equipment and perfect service. We will make unremitting efforts to enhance the development of the domestic semiconductor equipment industry and add color to the industry!

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HAD3610 precision abrasive-wheel dicing machine
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