HAD3310 precision abrasive-wheel dicing machine
Specification Snapshot
Weight
580 Kg
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Specifications
| Parameter | Value |
|---|---|
| Larger workpiece dimension (φ) [Circular workpiece] | φ300 |
| Larger workpiece dimension (□) [Square workpiece] | □280 |
| Cutting depth | Max 4 or custom |
| Spindle - Rotational-speed range | 3000-60000 r/min |
| Spindle - Output power | DC, 2.4at6000 |
| X Axis-Travel | 430 mm |
| X axis - Speed-setting range | 0.1~400 mm/s |
| Y Axis-Travel | max310 |
| Y axis - Single-step accuracy | ≤0.002/5 |
| Y axis - Accumulated error | ≤0.004/310 |
| Z axis - Effective travel | 45 mm |
| Z Axis-Repeatability | 0.001 mm |
| θ axis - Drive method | DD motor |
| θ axis - Resolution | 1 ″ |
| Automatic alignment | Available |
| Non-contact height measurement [Model parameter table] | Available |
| Blade-breakage detection | Optional |
| Power Supply | Single-phase, AC220±10% |
| Volume WXDXH | 910 mm × 1100 mm × 1860 mm |
| Weight | 580 Kg |
| Ambient Operating Temperature | 20~25℃ |
| Operating-environment temperature fluctuation | Within ±1℃ |
| Ambient Operating Humidity [Indoors; Non-condensing] | <80% |
| Compressed-air dew point [Atmospheric pressure; Clean compressed air] | -15℃ or below |
| Compressed-air residual oil content | 0.1ppm |
| Compressed-air filtration degree | 0.01um/99.5 or above |
| Cutting-water temperature | Room temperature +2℃ |
| Cutting-water temperature fluctuation | Within ±1℃ |
| Cooling Water Temperature | Same as room temperature |
| Cooling-water temperature fluctuation | Within ±1℃ |
| Installation-environment clearance | Avoid heavy impacts and external vibration; Do not install near blowers, ventilation outlets, high-temperature equipment or oily equipment |
| Installation floor and drainage | Waterproof floor with unobstructed drainage |
Applications
12-inch silicon wafers, LED packaging, QFN, DNF, BGA, optics/optoelectronics, communications, PCB, ceramics, glass, lithium niobate, alumina, and quartz.
Key Features
Large-format dicing with a large processing size of φ12; an imported air spindle with a standard 2.4KW high-torque spindle; optional noncontact height sensing (NCS) and blade-breakage detection (BBD); a direct-drive DD motor on the θ axis for high accuracy and speed; high-speed image recognition, multiple alignment modes, and rapid edge finding to improve efficiency.
Datasheet
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Supplier Information
Shenyang Hanway Technology Co., Ltd. is located at No. 19, Hunnan East Road, Hunnan New District, Shenyang City. It is a high-tech company mainly engaged in the R&D, sales, and service of semiconductor special equipment and accessories. With a technical team, product technology, and rich industry experience, it has a broad user base in various regions and provides reasonable and practical product solutions for customers.
Hanway Technology focuses on the field of precision dicing and grinding of semiconductor materials. It produces HAD1600 series, HAD2600 series, HAD1800 series, and HAD3310 series precision dicing saws. Suitable for precision cutting of silicon, ceramics, PCB boards, EMC, quartz, glass, gallium arsenide, lithium niobate, and other materials, widely used in IC integrated circuits, discrete devices, LED packaging, optical communication devices, NTC, MEMS, photovoltaics, medical devices, scintillation crystals, and other industries.
Customer demand is our work goal, and customer satisfaction is our direction! Shenyang Hanway Technology Co., Ltd. will continue to strive to provide customers with good equipment and perfect service. We will make unremitting efforts to enhance the development of the domestic semiconductor equipment industry and add color to the industry!
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