Cluster multifunctional thin-film deposition system (Cluster)

Cluster multifunctional thin-film deposition system (Cluster)

Supplier
Gilitek
Category
Semiconductor Manufacturing Equipment
Origin
China

The equipment coats substrates up to 300mmX300mm. Its compact cluster layout places a transfer chamber centrally and functional coating chambers around it for easy substrate transfer. Peripheral chambers can be configured for evaporation, magnetron sputtering, plasma cleaning, or other functions to customer requirements.

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Overview

The equipment coats substrates up to 300mmX300mm. Its compact cluster layout places a transfer chamber centrally and functional coating chambers around it for easy substrate transfer. Peripheral chambers can be configured for evaporation, magnetron sputtering, plasma cleaning, or other functions to customer requirements.

Specifications

ParameterValue
Transfer chamber and transfer robot arm - Ultimate vacuum8E-5Pa
Transfer chamber and transfer robot arm - Robot sample-transfer positioning accuracy±0.2mm
Sample loading/unloading chamber (loadlock) - Ultimate vacuum8E-5Pa
Sample loading/unloading chamber (loadlock) - Cassette [Standards]10layers
Evaporation-deposition chamber - Ultimate vacuum4E-5Pa
Evaporation-deposition chamber - Substrate-stage mechanical alignment accuracy±0.2mm
Evaporation-deposition chamber - CCD alignment accuracy±5um
High-temperature evaporation-deposition chamber - Ultimate vacuum4E-5Pa
High-temperature evaporation-deposition chamber - Substrate-stage mechanical alignment accuracy±0.2mm
Rotating chamber90 degrees, 180 degrees and 270 degrees
Inverting chamber180degrees
Heating/bakeout chamberHeating and bakeout degassing of substrates or MASK
Test data (film-thickness uniformity) - Target rate2A/S
Test data (film-thickness uniformity) - Experimental data 1 - Sequence number - 1 [Target Rate: 2A/S]760.1
Test data (film-thickness uniformity) - Experimental data 1 - Sequence number - 2 [Target Rate: 2A/S]777.95
Test data (film-thickness uniformity) - Experimental data 1 - Sequence number - 3 [Target Rate: 2A/S]774.6
Test data (film-thickness uniformity) - Experimental data 1 - Sequence number - 4 [Target Rate: 2A/S]788.4
Test data (film-thickness uniformity) - Experimental data 1 - Sequence number - 5 [Target Rate: 2A/S]800.8
Test data (film-thickness uniformity) - Experimental data 1 - Sequence number - 6 [Target Rate: 2A/S]799.4
Test data (film-thickness uniformity) - Experimental data 1 - Sequence number - 7 [Target Rate: 2A/S]797.05
Test data (film-thickness uniformity) - Experimental data 1 - Sequence number - 8 [Target Rate: 2A/S]788.7
Test data (film-thickness uniformity) - Experimental data 1 - Sequence number - 9 [Target Rate: 2A/S]776.75
Test data (film-thickness uniformity) - Experimental data 1 - Sequence number - 10 [Target Rate: 2A/S]762.95
Test data (film-thickness uniformity) - Experimental data 1 - Sequence number - 11 [Target Rate: 2A/S]747.3
Test data (film-thickness uniformity) - Experimental data 1 - Sequence number - 12 [Target Rate: 2A/S]775.95
Test data (film-thickness uniformity) - Experimental data 1 - Sequence number - 13 [Target Rate: 2A/S]777
Test data (film-thickness uniformity) - Experimental data 1 [Target Rate: 2A/S]min:747.3; max:800.8
Test data (film-thickness uniformity) - Experimental data 1 - Uniformity [Target Rate: 2A/S]0.03456
Test data (film-thickness uniformity) - Experimental data 2 - Sequence number - 1 [Target Rate: 2A/S]1090.95
Test data (film-thickness uniformity) - Experimental data 2 - Sequence number - 2 [Target Rate: 2A/S]1106.5
Test data (film-thickness uniformity) - Experimental data 2 - Sequence number - 3 [Target Rate: 2A/S]1115.25
Test data (film-thickness uniformity) - Experimental data 2 - Sequence number - 4 [Target Rate: 2A/S]1131.6
Test data (film-thickness uniformity) - Experimental data 2 - Sequence number - 5 [Target Rate: 2A/S]1142.9
Test data (film-thickness uniformity) - Experimental data 2 - Sequence number - 6 [Target Rate: 2A/S]1140.45
Test data (film-thickness uniformity) - Experimental data 2 - Sequence number - 7 [Target Rate: 2A/S]1130.4
Test data (film-thickness uniformity) - Experimental data 2 - Sequence number - 8 [Target Rate: 2A/S]1115.05
Test data (film-thickness uniformity) - Experimental data 2 - Sequence number - 9 [Target Rate: 2A/S]1105.85
Test data (film-thickness uniformity) - Experimental data 2 - Sequence number - 10 [Target Rate: 2A/S]1106.75
Test data (film-thickness uniformity) - Experimental data 2 - Sequence number - 11 [Target Rate: 2A/S]1088.35
Test data (film-thickness uniformity) - Experimental data 2 - Sequence number - 12 [Target Rate: 2A/S]1087.55
Test data (film-thickness uniformity) - Experimental data 2 - Sequence number - 13 [Target Rate: 2A/S]1093
Test data (film-thickness uniformity) - Experimental data 2 [Target Rate: 2A/S]min:1087.55; max:1142.9
Test data (film-thickness uniformity) - Experimental data 2 - Uniformity [Target Rate: 2A/S]0.02482
Test data (film-thickness uniformity) - Experimental data 3 - Sequence number - 1 [Target Rate: 2A/S]673.8
Test data (film-thickness uniformity) - Experimental data 3 - Sequence number - 2 [Target Rate: 2A/S]679.4
Test data (film-thickness uniformity) - Experimental data 3 - Sequence number - 3 [Target Rate: 2A/S]688.15
Test data (film-thickness uniformity) - Experimental data 3 - Sequence number - 4 [Target Rate: 2A/S]692
Test data (film-thickness uniformity) - Experimental data 3 - Sequence number - 5 [Target Rate: 2A/S]697
Test data (film-thickness uniformity) - Experimental data 3 - Sequence number - 6 [Target Rate: 2A/S]698.8
Test data (film-thickness uniformity) - Experimental data 3 - Sequence number - 7 [Target Rate: 2A/S]694.55
Test data (film-thickness uniformity) - Experimental data 3 - Sequence number - 8 [Target Rate: 2A/S]690.3
Test data (film-thickness uniformity) - Experimental data 3 - Sequence number - 9 [Target Rate: 2A/S]686.7
Test data (film-thickness uniformity) - Experimental data 3 - Sequence number - 10 [Target Rate: 2A/S]678.05
Test data (film-thickness uniformity) - Experimental data 3 - Sequence number - 11 [Target Rate: 2A/S]669.6
Test data (film-thickness uniformity) - Experimental data 3 - Sequence number - 12 [Target Rate: 2A/S]704.85
Test data (film-thickness uniformity) - Experimental data 3 - Sequence number - 13 [Target Rate: 2A/S]689.7
Test data (film-thickness uniformity) - Experimental data 3 [Target Rate: 2A/S]min:669.6; max:704.85
Test data (film-thickness uniformity) - Experimental data 3 - Uniformity [Target Rate: 2A/S]0.02565

Applications

IBS chamber: High-power laser and precision optical coatings. PECVD chamber: Thin-film substrate encapsulation with silicon nitride and other films. Magnetron-sputtering chamber: ITO transparent conductive electrodes or sputtered aluminum electrodes. ALD chamber: Aluminum-oxide films for substrate encapsulation. Glovebox and internal auxiliary equipment, such as measurement and dispensing/press-bonding equipment: Encapsulation and testing under nitrogen protection after downstream substrate removal.

Datasheet

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Supplier Information

Gi
Gilitek
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Jelight (Suzhou) Precision Instrument Co., Ltd. was established in August 2013 and is a high-tech enterprise specializing in the research and development, production, and sales of precision thin film deposition equipment. Currently, the company has R&D centers in Milpitas, USA and Suzhou Industrial Park, Jiangsu; a 15,000-square-meter production base in Zhangjiagang, Jiangsu; and sales and after-sales service centers in Xi'an, Beijing, and other places. Adhering to the mission of "developing high-end coating technology and building a first-class coating equipment enterprise," the company is fully committed to optimizing process control and fine management, advocating the business philosophy of "honesty as the foundation, credibility as the career," and striving to forge a brilliant future for the enterprise. The company possesses world-advanced vacuum coating technology and has applied for multiple patents. Product types include ion beam sputtering coating machines (IBS), magnetron sputtering coating machines, electron beam/resistance evaporation coating machines, and multifunctional thin film deposition systems (In-Line, Cluster), etc., while also undertaking coating process consulting services and other businesses. The coating machines produced by the company not only have stable performance but also feature outstanding advantages such as multi-point synchronous precision optical monitoring systems and real-time film thickness distribution control, which can meet the equipment needs of various coating demand markets. Among them, ion sputtering coating machines and magnetron sputtering coating machines are particularly suitable for making various high-difficulty optical thin film products. The company will fully leverage its own technological advantages, always adhere to the quality philosophy of "rigorous and focused, striving for perfection," and sincerely create product value for customers. We welcome inquiries from all walks of life!

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Cluster multifunctional thin-film deposition system (Cluster)
Gilitek · Semiconductor Manufacturing Equipment
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