Ion-beam sputtering coater (loadlock)
Upward sputtering with the coated surface facing downward and a loadlock chamber enables continuous operation for improved productivity.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Main structure | Loadlock chamber + process chamber |
| Process-chamber dimensions - Diameter | 1040mm |
| Process-chamber dimensions - Height | 960mm |
| Ultimate Vacuum | Below 4.0E-5Pa |
| Gas-leak rate [Helium leak rate] | ≤5E-9Pa·m3/s (helium leak rate) |
| Gas-leak rate - Pressure holding [12 hours] | Pressure holding for 12 hours ≤5Pa |
| Substrate dimensions | Maximum 12 inches |
| Ion-source system - RF main source | 16cm |
| Ion-source system - RF auxiliary source | 12cm |
| Sputtering-target system | 4 square targets with adjustable positions |
| Film-thickness system | Transmission optical monitoring system / inline quartz crystal system |
| Film-thickness uniformity [Outside a radius of 70mm] | ≤±0.5% (outside radius 70mm) |
| Vacuum System | Dry pump + turbomolecular pump or dry pump + cryopump |
| Substrate-transfer failure rate | ≤1% |
| Equipment dimensions - Width | 3500 mm |
| Equipment dimensions - Depth | 2200 mm |
| Equipment dimensions - Height | 2750 mm |
Datasheet
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