Thermal atomic layer deposition TALD equipment
Ensures uniform, high-quality coatings even on complex 3D surfaces. Particularly suitable for precise, consistent coating of deep trenches and high-aspect-ratio structures.
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Overview
Ensures uniform, high-quality coatings even on complex 3D surfaces. Particularly suitable for precise, consistent coating of deep trenches and high-aspect-ratio structures.
Specifications
| Parameter | Value |
|---|---|
| Substrate dimensions | 50~300mm;200x200mm;φ300x400mm |
| Precursor | Different precursors configurable |
| Typical process | Al2O3, TiO2, SiO2, Ta2O5, HfO2, TiN, AIN, etc |
| Evacuation Time [8.0×10-2Pa] | 8.0×10-2Pa ≤25 minutes |
| Deposition temperature | 50~400C |
| Deposition rate | 8 s/cycle |
| Uniformity | ±1% |
Applications
Our TALD (thermal atomic layer deposition) systems are designed for precision thin-film coating in the following areas: solar—perovskite and crystalline-silicon solar cells; microelectronics—MEMS, MLCC, SAW, BAW and SiC MOSFET; optoelectronics—LED, Micro-LED, OLED, VECSEL and AR/VR; complex components—optical lenses, ultra-black coatings and wear-resistant films on complex metal parts; and more. Application areas: optics, semiconductors, photovoltaics and microelectronics.
Key Features
Product advantages: customized TALD solutions; excellent conformality for deep holes and high-aspect-ratio structures; extremely dense films with virtually no pinholes; atomic-layer control for micron- and nanometer-scale deposition; self-limiting reactions for excellent repeatability and consistency; uniform large-area deposition or batch production. Optional ozone source/plasma source.
Datasheet
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Supplier Information
Guangdong Huicheng Vacuum Technology Co., Ltd. is a global vacuum application solution provider, engaged in the R&D, production and sales of optical coating equipment, functional thin film coating equipment, decorative coating equipment, roll-to-roll coating equipment, automotive parts coating equipment, continuous magnetron sputtering coating production lines, ultra-high vacuum systems and other vacuum equipment, ALD atomic layer deposition equipment, semiconductor equipment, electronic production equipment, optoelectronic equipment, photovoltaic equipment, power battery equipment and related accessories. It is a national high-tech enterprise focusing on the R&D and application of equipment and product-related manufacturing processes and application technologies, control software, process control software and related production automation software, and provides technology transfer, technical consulting and technical services.
The company was founded in 2006 and has hired senior experts and senior engineers in the domestic vacuum industry to specifically guide and be responsible for the R&D and design of new products. It has obtained multiple invention, design, utility model patents and copyrights, and was successfully listed on the ChiNext Board of the Shenzhen Stock Exchange in June 2024.
HCVAC provides complete thin film deposition solutions for precision optics, optoelectronics, new energy, flat panel display, semiconductors, power devices, tooling and molds, aviation, automotive, mobile phones, hardware and other markets. From R&D to prototyping and mass production, with core technology combinations such as evaporation, sputtering, PECVD, and ALD, we can provide practical production recommendations, R&D services and custom engineering to meet customers' personalized needs.
Focusing on cutting-edge fields such as semiconductors, new energy, 5G/6G communications, IoT sensors, and artificial intelligence (AI chip packaging/CoWoS), the company has set up four major laboratories: optical thin films, functional coatings, pan-semiconductors, and new materials. It works closely with customers to develop future equipment and processes, develops new film formation technologies through investment or cooperation, and continuously improves coating equipment.
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