Cluster coating platform
ICP-assisted magnetron sputtering produces low-absorption, low-stress optical coatings for various bandpass and cutoff applications, such as face recognition (Face lD) and high-transmission mid- and far-infrared coatings. Magnetron sputtering deposits metals such as Cu, Al, Cr, Au, Ag and SUS. Process development improves deep-hole coating, providing excellent step coverage for MEMS chip packaging. Modular equipment can combine Plasma-clean, magnetron sputtering (SPT), plasma-enhanced chemical reaction (PECVD), atomic layer deposition (ALD) and reactive-ion etching (RIE) units into a cluster processing center covering substrate cleaning, thin-film deposition including ultrathin films, and patterned etching for semiconductor micro- and nanostructures. It meets stringent deposition-uniformity specifications, minimizes high-stress film defects, improves throughput and reduces costs.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Wafer loading capacity [Wafer size 4″] | 16 |
| Wafer loading capacity [Wafer size 6″] | 12 |
| Wafer loading capacity [Wafer size 8″] | 9 |
| Wafer loading capacity [Wafer size 12″] | 5 |
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Datasheet
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Wafer Bonding
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