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Glass Cutting Tape UV Film and Ultraviolet Curing Tape for Ceramic Substrates
Accessories

Glass Cutting Tape UV Film and Ultraviolet Curing Tape for Ceramic Substrates

Supplier
Csgqet
Category
Accessories
Origin
China

UV TAPE Optional Anti-static UV duct tape and non-antistatic transparency UV Tape 。 In use LED When Processing Chips ， Put the chip on. UV The membrane keeps the crystal particles intact in cutting. . Reducing the collapses of cutting . Make sure the crystal particles are in the normal course of transmission. , There will be no shift. 、 Flows . There's no residue. . It's a proper expansion. . The crystals are easy to remove. . The water doesn't see through the crystals and the tape. . is. Semiconductor Cutting process ， The film as a carrier. ， Different viscos have different effects on the quality of cutting. 。 Use of more viscous film prevents insulation. die Fly out. ， And get better cutting quality. 。 But... is And the corresponding ones are there because of the strong adhesive force. die Picking difficulties 。 So... ， is. Semiconductor Wafer And select the appropriate film during the base plate cutting. ， Enabling quality and cost control 。 The grinding tape is used in the right Wafer When Grinding Its Back Surface ， Protect the electrical surface from damage caused by outside aliens. 、 Break 、 Fragmentation and pollution. 。 Characteristics of the cutting of the film 1、 2、 Good time stability. 、 Accompaniment 、 sprawl 。 3、 Easier to strip ， Effective protection against the residue 。 4、 A variety of offers Dimensions Specifications ， You can also do as you like. Custom 。 The properties of the film. 1、 Application Wafer Grinding on the back 。 2、 Yeah. Wafer The condensed face is very sticky. 。 3、 It's a good stripping. 。 4、 A variety of offers Dimensions Specifications ， You can also do as you like. Custom 。

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Overview

UV TAPE Optional Anti-static UV duct tape and non-antistatic transparency UV Tape 。 In use LED When Processing Chips ， Put the chip on. UV The membrane keeps the crystal particles intact in cutting. . Reducing the collapses of cutting . Make sure the crystal particles are in the normal course of transmission. , There will be no shift. 、 Flows . There's no residue. . It's a proper expansion. . The crystals are easy to remove. . The water doesn't see through the crystals and the tape. . is. Semiconductor Cutting process ， The film as a carrier. ， Different viscos have different effects on the quality of cutting. 。 Use of more viscous film prevents insulation. die Fly out. ， And get better cutting quality. 。 But... is And the corresponding ones are there because of the strong adhesive force. die Picking difficulties 。 So... ， is. Semiconductor Wafer And select the appropriate film during the base plate cutting. ， Enabling quality and cost control 。 The grinding tape is used in the right Wafer When Grinding Its Back Surface ， Protect the electrical surface from damage caused by outside aliens. 、 Break 、 Fragmentation and pollution. 。 Characteristics of the cutting of the film 1、 2、 Good time stability. 、 Accompaniment 、 sprawl 。 3、 Easier to strip ， Effective protection against the residue 。 4、 A variety of offers Dimensions Specifications ， You can also do as you like. Custom 。 The properties of the film. 1、 Application Wafer Grinding on the back 。 2、 Yeah. Wafer The condensed face is very sticky. 。 3、 It's a good stripping. 。 4、 A variety of offers Dimensions Specifications ， You can also do as you like. Custom 。

Applications

Application Semiconductor Wafer 、 Seal Board 、 Ceramic 、 Glass Wait for the hard-core. Material Cut 。

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Supplier Information

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Csgqet
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Changsha Guangqi Electronic Technology Co., Ltd. was founded in 2011 and has been deeply engaged in the semiconductor and optoelectronics industry for fifteen years. It is a comprehensive service provider integrating precision processing equipment, accessories, consumables supply and dicing/grinding foundry services. The company's business covers core fields such as semiconductor chip manufacturing and packaging testing, LED chip manufacturing and product packaging, lighting applications and high-precision optical glass processing. For key processes such as dicing, grinding and polishing, it provides one-stop "equipment - accessories - consumables" supporting solutions to help customers achieve stable and efficient production from a single process to the whole process. Core product system: Processing consumables: dicing blades, thinning grinding wheels Key components: air-bearing spindles, tool holders/flanges, ceramic parts Auxiliary consumables: dicing/grinding tape, cutting fluid Supporting equipment: film laminating machines, UV machines, etc. Foundry services: In 2025, the company added ceramic substrate and optical glass dicing foundry business, and its products are widely used in fast-growing emerging fields such as AI computing power and optical communications. In the future, it will also expand foundry services for semiconductor material grinding processes, gradually building full-process "dicing + grinding" foundry capabilities and providing customers with a complete value loop from consumables supply to process delivery. Relying on stable product quality and high cost-effectiveness, Guangqi's products and foundry services have been widely used by many domestic semiconductor and optoelectronics manufacturing enterprises, and have won a good reputation in the industry with professional services. The company always adheres to customer demand orientation, aims to improve customer production efficiency and product quality, practices the business philosophy of "professionalism, integrity, innovation", and repays every customer with the most reasonable price, the most complete service and the best quality products, striving to become the largest comprehensive dicing and grinding service provider in Central China.

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