Sapphire Laser Drilling equipment
The equipment is based on leading technology. Optical Fiber Picosecond Laser , Precision and fine processing applications are achieved , Resolve Glass 、 Sapphire 、 Ceramic 、 Silicon Wafer Wait hard. 、 Cracker. Material The precision of processing problems 。 High accuracy of equipment processing 、 Good quality. 、 Speed! , Performance is stable. , Already Sapphire Process 、 Glass Micro-pore processing 、 Successful applications in the areas of fine processing , Advanced and sophisticated for clients Laser Process Solutions 。
Specification Snapshot
Wavelength [Wavelength =515nm( Green Light ); Laser Average output power =10W]
515nm( Green Light )
Pulse Energy [Wavelength =515nm( Green Light ); Laser Average output power =10W]
10uJ
Repetition Rate [Wavelength =515nm( Green Light ); Laser Average output power =10W]
1MHz
Pulse Width [Wavelength =515nm( Green Light ); Laser Average output power =10W]
50ps
Wavelength [Wavelength =515nm( Green Light ); Laser Average output power =15W]
515nm( Green Light )
Pulse Energy [Wavelength =515nm( Green Light ); Laser Average output power =15W]
10uJ
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Overview
The equipment is based on leading technology. Optical Fiber Picosecond Laser , Precision and fine processing applications are achieved , Resolve Glass 、 Sapphire 、 Ceramic 、 Silicon Wafer Wait hard. 、 Cracker. Material The precision of processing problems 。 High accuracy of equipment processing 、 Good quality. 、 Speed! , Performance is stable. , Already Sapphire Process 、 Glass Micro-pore processing 、 Successful applications in the areas of fine processing , Advanced and sophisticated for clients Laser Process Solutions 。
Specifications
| Parameter | Value |
|---|---|
| Size of equipment | 1400mm*1500mm*1800mm |
| Equipment Weight | 1900Kg |
| Equipment distribution | 380V AC,50/60Hz ; The whole plane. 10KW( It's dusty. 、 Cold water machine ) |
| Use Environment | Cleaning plant ,15-30℃ , The relative humidity must be maintained at 20-80% Internal , No sign of it. |
| Wavelength [Wavelength =515nm( Green Light ); Laser Average output power =10W] | 515nm( Green Light ) |
| Laser Average output power [Wavelength =515nm( Green Light ); Laser Average output power =10W] | 10W |
| Pulse Energy [Wavelength =515nm( Green Light ); Laser Average output power =10W] | 10uJ |
| Repetition Rate [Wavelength =515nm( Green Light ); Laser Average output power =10W] | 1MHz |
| Pulse Width [Wavelength =515nm( Green Light ); Laser Average output power =10W] | 50ps |
| Beam Mass M² [Wavelength =515nm( Green Light ); Laser Average output power =10W] | less than 1.3 |
| Output power stability [Wavelength =515nm( Green Light ); Laser Average output power =10W] | ±5% |
| Cooling methods [Wavelength =515nm( Green Light ); Laser Average output power =10W] | Heat Water Cooled |
| Wavelength [Wavelength =515nm( Green Light ); Laser Average output power =15W] | 515nm( Green Light ) |
| Laser Average output power [Wavelength =515nm( Green Light ); Laser Average output power =15W] | 15W |
| Pulse Energy [Wavelength =515nm( Green Light ); Laser Average output power =15W] | 10uJ |
| Repetition Rate [Wavelength =515nm( Green Light ); Laser Average output power =15W] | 1.5MHz |
| Pulse Width [Wavelength =515nm( Green Light ); Laser Average output power =15W] | 50ps |
| Beam Mass M² [Wavelength =515nm( Green Light ); Laser Average output power =15W] | less than 1.3 |
| Output power stability [Wavelength =515nm( Green Light ); Laser Average output power =15W] | ±5% |
| Cooling methods [Wavelength =515nm( Green Light ); Laser Average output power =15W] | Heat Water Cooled |
| Wavelength [Wavelength =1030nm( Infrared ); Laser Average output power =30W] | 1030nm( Infrared ) |
| Laser Average output power [Wavelength =1030nm( Infrared ); Laser Average output power =30W] | 30W |
| Pulse Energy [Wavelength =1030nm( Infrared ); Laser Average output power =30W] | 30uJ |
| Repetition Rate [Wavelength =1030nm( Infrared ); Laser Average output power =30W] | 500kHz |
| Pulse Width [Wavelength =1030nm( Infrared ); Laser Average output power =30W] | 50ps |
| Beam Mass M² [Wavelength =1030nm( Infrared ); Laser Average output power =30W] | less than 1.3 |
| Output power stability [Wavelength =1030nm( Infrared ); Laser Average output power =30W] | ±5% |
| Cooling methods [Wavelength =1030nm( Infrared ); Laser Average output power =30W] | Heat Water Cooled |
| Wavelength [Wavelength =1030nm( Infrared ); Laser Average output power =60W] | 1030nm( Infrared ) |
| Laser Average output power [Wavelength =1030nm( Infrared ); Laser Average output power =60W] | 60W |
| Pulse Energy [Wavelength =1030nm( Infrared ); Laser Average output power =60W] | 30uJ |
| Repetition Rate [Wavelength =1030nm( Infrared ); Laser Average output power =60W] | 2MHz |
| Pulse Width [Wavelength =1030nm( Infrared ); Laser Average output power =60W] | 50ps |
| Beam Mass M² [Wavelength =1030nm( Infrared ); Laser Average output power =60W] | less than 1.3 |
| Output power stability [Wavelength =1030nm( Infrared ); Laser Average output power =60W] | ±5% |
| Cooling methods [Wavelength =1030nm( Infrared ); Laser Average output power =60W] | Heat Water Cooled |
| Wavelength [Wavelength =1030nm( Infrared ); Laser Average output power =90W] | 1030nm( Infrared ) |
| Laser Average output power [Wavelength =1030nm( Infrared ); Laser Average output power =90W] | 90W |
| Pulse Energy [Wavelength =1030nm( Infrared ); Laser Average output power =90W] | 30uJ |
| Repetition Rate [Wavelength =1030nm( Infrared ); Laser Average output power =90W] | 3MHz |
| Pulse Width [Wavelength =1030nm( Infrared ); Laser Average output power =90W] | 50ps |
| Beam Mass M² [Wavelength =1030nm( Infrared ); Laser Average output power =90W] | less than 1.3 |
| Output power stability [Wavelength =1030nm( Infrared ); Laser Average output power =90W] | ±5% |
| Cooling methods [Wavelength =1030nm( Infrared ); Laser Average output power =90W] | Heat Water Cooled |
Applications
Sapphire Cellular Screen Cut 、 Cell phone. HOME Key Drilling 、 Camera Protective Filter Sniper cutting 、 Watch lid processing 、 Sapphire Sline Process 、 Silicon Carbide Wafer Cut 、 Show panel drills and cuttings 、 Precision punches and Custom Shaped Cut 。
Key Features
Efficiency : Imports used Optical Fiber Laser , It's going fast. , High stability. Precision : Imported High Precision Photo-routing system , High stability work platform equipped High probability. : High product completion rate , Consistency is good.
Datasheet
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Supplier Information
Hangzhou Yinhu Laser Technology Co., Ltd. is a high-tech enterprise founded by national leading talents. The company focuses on the R&D, production and sales of laser micro-nano manufacturing equipment for chip packaging materials. Its products cover high-speed computing chip packaging and high-power chip packaging materials, with specific processing materials including glass, ceramics, sapphire, diamond, gallium oxide, etc.
The company's R&D team is led by international professional academicians and has research talents including doctors, masters and bachelors from home and abroad. Relying on multiple laser manufacturing research platforms such as the Provincial and Ministerial Co-construction Collaborative Innovation Center for High-end Laser Manufacturing Equipment and the Zhejiang Yinhu Laser Micro-nano Processing Equipment Enterprise High-tech Research and Development Center, the company has established cooperative relations with universities and institutes such as Zhejiang University of Technology, Shanghai Institute of Optics and Fine Mechanics and Xi'an Institute of Optics and Precision Mechanics of CAS. The company has won honors such as National High-tech Enterprise, Zhejiang Provincial Enterprise High-tech R&D Center, Hangzhou Leading Innovation Team, Zhejiang Provincial Specialized, Refined, Distinctive and Innovative SME, and Zhejiang Provincial Innovative SME. The company's self-developed ultrafast laser transparent material processing equipment has served many leading enterprises in China.
Yinhu Laser has always adhered to the development philosophy of "Professional, Innovative, Win-win", always serving every customer with professional technology and providing customers with satisfactory laser manufacturing solutions.
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