Laser+TFLN modulator co-packaged product

Laser+TFLN modulator co-packaged product

Supplier
Ori-chip
Category
Laser Modules & Systems
Origin
China

It co-encloses a low RIN laser source with a thin film lithium niobate modulator, and there are two MPDs to monitor the magnitude of the source and the final outgoing optical power, which saves space for the users. Based on state-of-art Lithium Niobate on insulator (LNOI) technology, this intensity modulator inherits most of the advantages of traditional lithium niobate modulators, and has a miniature form factor, low driving voltage and low loss. The intensity modulator maintains a more stable bias point than conventional lithium niobate modulators.

Specification Snapshot
3dB bandwidth
>20G/40G
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Overview

It co-encloses a low RIN laser source with a thin film lithium niobate modulator, and there are two MPDs to monitor the magnitude of the source and the final outgoing optical power, which saves space for the users. Based on state-of-art Lithium Niobate on insulator (LNOI) technology, this intensity modulator inherits most of the advantages of traditional lithium niobate modulators, and has a miniature form factor, low driving voltage and low loss. The intensity modulator maintains a more stable bias point than conventional lithium niobate modulators.

Specifications

ParameterValue
Maximum light output13dBm
ER>20dB
3dB bandwidth>20G/40G
AC Vpi<3.5V
RIN<-160dB/Hz

Applications

RoF, Antenna Teleportation, Microwave and Radar Communications.

Datasheet

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Supplier Information

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Ori-chip
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Founded in 2018, Ori-Chip Optoelectronics Technology Co. Ltd., is dedicated to make the state-of-the-art photonic integrated circuits, including both InP and thin-film lithium niobate platforms. Our main products include: full C-band Widely-tunable lasers,Thin-film lithium niobate MZM modulators,and DFB laser diodes for both fiber optic communication and sensing. Using the cutting-edge InP and thin-film lithium niobate technology, our products deliver the best performance at competitive price. We hold multiple IPs, including patents from both China and the United States. All of our products are made in-house by ORI-CHIP wafer fabs.

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Laser+TFLN modulator co-packaged product
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