PA36e Thermal Evaporation Coating Machine

Chamber dimensions: 360 × 500 mm (H). Ultimate vacuum ≤3 × 10⁻⁵ Pa; pressure ≤5 Pa after a 12-hour hold. Film-thickness uniformity ≥95%; repeatability ≥95%. Substrates ≤100 mm × 100 mm. Nine mask positions, with three positions per substrate. Fully automatic control software. Vacuum coating chamber: stainless-steel bell jar and 304 stainless-steel base; separately specified dimensions Φ300 × H415 mm. Vacuum system: molecular-pump plus mechanical-pump high-vacuum system. Molecular pump: pumping speed 1200 L/S, described as a truly quasi-oil-free vacuum system; downward pumping avoids the stated pumping weakness of molecular pumps and improves pumping speed. Five-year molecular-pump warranty with direct replacement if damaged; imported molecular pump optional. Vacuum pump: rotary-vane pump with oil-mist filter and gas-ballast control; flow 36 m³/h (21 cfm), described as dual-substrate; vacuum <2 × 10⁻³ mbar, or an optional dry pump. A dry vacuum pump is also listed as an option. Vacuum measurement: two resistance gauges for low vacuum and one ionization gauge for high vacuum; digital combined vacuum gauge covering 1 × 10⁵ Pa to 1 × 10⁻⁵ Pa, displayed and controlled by PC with interlocking operation. An imported wide-range vacuum transmitter is optional. Substrate stage: 304 stainless steel, directly above the evaporation source, with fully automatic raising/lowering. Fixtures are designed for substrate size to secure samples conveniently. An integrated high-precision etched mask can be customized. Rotation: stepper-motor drive with a ferrofluidic seal; the motor and seal are coaxial to avoid lost rotation and creeping, with precise control and continuously adjustable 0–30 rpm speed. Raising/lowering: specified as stepper-motor-controlled rotation with a ferrofluidic seal and precise control; height continuously adjustable over 0–100 mm. Mask: drawer structure carrying samples with a stated maximum smaller than 120 × 120 mm; Japanese SMC pneumatic substrate shutter with fully automatic electrical interlocking. Organic evaporation source: organic sublimation effusion furnace, with 5 CC charge capacity per source. An upper heat shield prevents upward radiation from the evaporation boat; thermal-interference protection is provided between sources, with easy loading, removal, cleaning and maintenance. Evaporation temperature: intelligent PID control, heating to 600°C with ±1°C control accuracy. Power supply: intelligent PID-controlled evaporation supply with source-temperature measurement and power adjustment for real-time temperature measurement/control, accuracy ±1°C. Organic evaporation-supply control: RS-485 interface, continuously adjustable power from 0 to maximum. Control system: Windows platform and cotrl2000 control system using IPC+network technology for parameter settings of main components, real-time monitoring, intelligent fault diagnosis and fully automatic film-thickness monitoring. Automatic and manual modes are available. Except for loading/unloading samples, operations are software-controlled on the PC. Interfaces cover the vacuum system, process settings and gas admission/exhaust. Recipes on the industrial PC allow process programs and equipment parameters to be set, stored and printed. Film-thickness monitoring/control: quartz-crystal film-thickness controller, with a water-cooled probe near the substrate stage connected to the industrial PC. The controller monitors deposition rate and final thickness in real time, with stated accuracy ±1A (0.1 nm), and feeds information back to the PC. At the set thickness, it can automatically control the power supply to stop deposition. Water cooling: eight inlets and eight outlets, with a water-pressure relay controlling the main inlet. Main inlet/outlet connect to a 1P refrigerated recirculating chiller with a 10–25°C control range, supplying stable cooling water to the target, metal source, molecular pump and ferrofluidic unit for stable operation. A second water-cooling entry repeats eight inlets/eight outlets, main-inlet water-pressure-relay control, a 1P chiller at 10–25°C, and cooling for the metal source, molecular pump and ferrofluidic unit. Product certifications stated: ISO9001, CE and UL. Warranty: one year, with lifetime repair service. Application precautions: consult the Danger, Warning, Caution and related sections of the instruction manual.

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