XBZN-1000 (A/B/C)/1500 Smart robot polishing system
Smart robot polishing systems allow for the definitive photo-photo-processing of large-calibre, spherical, non-spherical, off-axis, non-spherical and free-curve components, and the processing of optical device materials covering: stone, glass, ULE, monocrystal, carbide, sapphire, ceramic, optical materials such as copper, aluminium, nickel, etc.
Specification Snapshot
Dimensions [Parameter graphs 1.png; XBZN-1000A column/clear sharing grid; specification table text rows]
2800 mm × 1250 mm × 2300 mm
Dimensions [Parameter graphs 1.png; XBZN-1000B column/specific sharing grid; specification table text rows]
2800 mm × 1250 mm × 2300 mm
Dimensions [Parameter graphs 1.png; XBZN-1000C column/clear sharing grid; specification table text rows]
2800 mm × 1250 mm × 2300 mm
Dimensions [Parameter graphs 1.png; XBZN-1500 column/clear sharing grid; specification table text rows]
3400 mm × 2100 mm × 3100 mm
Request a Quote
Download Datasheet
Overview
Smart robot polishing systems allow for the definitive photo-photo-processing of large-calibre, spherical, non-spherical, off-axis, non-spherical and free-curve components, and the processing of optical device materials covering: stone, glass, ULE, monocrystal, carbide, sapphire, ceramic, optical materials such as copper, aluminium, nickel, etc.
Specifications
| Parameter | Value |
|---|---|
| Grid Type [Parameters 1.png; XBZN-1000A column/clear sharing grid] | Type A: Fixed grinder |
| Workpiece Surface Types [Parameters 1.png; XBZN-1000A column/clear sharing grid] | Area/Spherical/ NonSpherical/Free Curve, etc. |
| Process shape [Parameters 1.png; XBZN-1000A column/clear sharing grid] | Circle/ Ellipse/Rect/ Polygon/Inner Opened Antagonal Hole, etc. |
| Maximum caliber of processing components [Parameter graphs 1.png; XBZN-1000A column/clear sharing grid; retention source range] | 50~1000 mm |
| Maximum Workpiece Thickness [Parameters 1.png; XBZN-1000A column/clear sharing grid] | ≤500 mm |
| - I'm gonna be able to get rid of it. [Parameters 1.png; XBZN-1000A column/clear sharing grid] | 3000 rpm |
| Workstation diameter [Parameters 1.png; XBZN-1000A column/clear sharing grid] | 1100 mm |
| Pressure set range [Parameter graphs 1.png; XBZN-1000A column/clear sharing grid; source field pressure, in N, not converted] | 0~125 N |
| Pressure set resolution [Parameters 1.png; XBZN-1000A column/clear sharing grid] | ±0.4 N |
| Process precision [Parameter graphs 1.png; XBZN-1000A column/clear sharing grid; plane; RMS] | ≤7 nm |
| Process precision [Parameter graphs 1.png; XBZN-1000A column/clear sharing grid; non-ball; RMS] | ≤10 nm |
| Polished Surface Roughness Ra [Parameters 1.png; XBZN-1000A column/clear sharing grid] | ≤1 nm |
| Surface Finish [Parameters 1.png; XBZN-1000A column/clear sharing grid] | Better than level II |
| Bit struts again precision [Parameters 1.png; XBZN-1000A column/specific sharing grid; ISO 9283] | ±0.05 mm |
| Maximum load capacity for mechanical arm [Parameters 1.png; XBZN-1000A column/clear sharing grid] | 45 Kg |
| Machine bed weight [Parameters 1.png; XBZN-1000A column/clear sharing grid] | Approximately 1.75 |
| Dimensions [Parameter graphs 1.png; XBZN-1000A column/clear sharing grid; specification table text rows] | 2800 mm × 1250 mm × 2300 mm |
| Grid Type [Parameters 1.png; XBZN-1000B column/clear share] | Type B: Rotating grinding board |
| Workpiece Surface Types [Parameters 1.png; XBZN-1000B column/clear share] | Area/Spherical/ NonSpherical/Free Curve, etc. |
| Process shape [Parameters 1.png; XBZN-1000B column/clear share] | Circle/ Ellipse/Rect/ Polygon/Inner Opened Antagonal Hole, etc. |
| Maximum caliber of processing components [Parameter graphs 1.png; XBZN-1000B column/clear sharing grid; retention of source range] | 50~1000 mm |
| Maximum Workpiece Thickness [Parameters 1.png; XBZN-1000B column/clear share] | ≤500 mm |
| - I'm gonna be able to get rid of it. [Parameters 1.png; XBZN-1000B column/clear share] | 3000 rpm |
| Workstation diameter [Parameters 1.png; XBZN-1000B column/clear share] | 1100 mm |
| Pressure set range [Parameter graphs 1.png; XBZN-1000B column/clear sharing grid; source field pressure, in N, not converted] | 0~125 N |
| Pressure set resolution [Parameters 1.png; XBZN-1000B column/clear share] | ±0.4 N |
| Process precision [Parameter graphs 1.png; XBZN-1000B column/clear sharing grid; plane; RMS] | ≤7 nm |
| Process precision [Parameter graphs 1.png; XBZN-1000B column/clear sharing grid; non-ball; RMS] | ≤10 nm |
| Polished Surface Roughness Ra [Parameters 1.png; XBZN-1000B column/clear share] | ≤1 nm |
| Surface Finish [Parameters 1.png; XBZN-1000B column/clear share] | Better than level II |
| Bit struts again precision [Parameters 1.png; XBZN-1000B column/specific sharing grid; ISO 9283] | ±0.05 mm |
| Maximum load capacity for mechanical arm [Parameters 1.png; XBZN-1000B column/clear share] | 45 Kg |
| Machine bed weight [Parameters 1.png; XBZN-1000B column/clear share] | Approximately 1.75 |
| Dimensions [Parameter graphs 1.png; XBZN-1000B column/specific sharing grid; specification table text rows] | 2800 mm × 1250 mm × 2300 mm |
| Grid Type [Parameter graphs 1.png; XBZN-1000C column/clear share] | Type C: Rotating Flipder |
| Workpiece Surface Types [Parameter graphs 1.png; XBZN-1000C column/clear share] | Area/Spherical/ NonSpherical/Free Curve, etc. |
| Process shape [Parameter graphs 1.png; XBZN-1000C column/clear share] | Circle/ Ellipse/Rect/ Polygon/Inner Opened Antagonal Hole, etc. |
| Maximum caliber of processing components [Parameter graphs 1.png; XBZN-1000C column/clear sharing grid; retention of source range] | 50~1000 mm |
| Maximum Workpiece Thickness [Parameter graphs 1.png; XBZN-1000C column/clear share] | ≤500 mm |
| - I'm gonna be able to get rid of it. [Parameter graphs 1.png; XBZN-1000C column/clear share] | 3000 rpm |
| Workstation diameter [Parameter graphs 1.png; XBZN-1000C column/clear share] | 1100 mm |
| Pressure set range [Parameter graphs 1.png; XBZN-1000C column/clear sharing grid; source field pressure, in N, not converted] | 0~125 N |
| Pressure set resolution [Parameter graphs 1.png; XBZN-1000C column/clear share] | ±0.4 N |
| Process precision [Parameters 1.png; XBZN-1000C column/clear sharing grid; plane; RMS] | ≤7 nm |
| Process precision [Parameter graphs 1.png; XBZN-1000C column/clear sharing grid; non-ball; RMS] | ≤10 nm |
| Polished Surface Roughness Ra [Parameter graphs 1.png; XBZN-1000C column/clear share] | ≤1 nm |
| Surface Finish [Parameter graphs 1.png; XBZN-1000C column/clear share] | Better than level II |
| Bit struts again precision [Parameters 1.png; XBZN-1000C column/clear sharing grid; ISO 9283] | ±0.05 mm |
| Maximum load capacity for mechanical arm [Parameter graphs 1.png; XBZN-1000C column/clear share] | 45 Kg |
| Machine bed weight [Parameter graphs 1.png; XBZN-1000C column/clear share] | Approximately 1.75 |
| Dimensions [Parameter graphs 1.png; XBZN-1000C column/clear sharing grid; specification table text rows] | 2800 mm × 1250 mm × 2300 mm |
| Grid Type [Parameter graphs 1.png; XBZN-1500 column/clear share] | Fixed grinder |
| Workpiece Surface Types [Parameter graphs 1.png; XBZN-1500 column/clear share] | Area/Spherical/ NonSpherical/Free Curve, etc. |
| Process shape [Parameter graphs 1.png; XBZN-1500 column/clear share] | Circle/ Ellipse/Rect/ Polygon/Inner Opened Antagonal Hole, etc. |
| Maximum caliber of processing components [Parameter graphs 1.png; XBZN-1500 column/clear share grid; retention source range] | 50~1500 mm |
| Maximum Workpiece Thickness [Parameter graphs 1.png; XBZN-1500 column/clear share] | ≤800 mm |
| - I'm gonna be able to get rid of it. [Parameter graphs 1.png; XBZN-1500 column/clear share] | 3000 rpm |
| Workstation diameter [Parameter graphs 1.png; XBZN-1500 column/clear share] | 1600 mm |
| Pressure set range [Parameter graphs 1.png; XBZN-1500 column/clear sharing grid; source field pressure, in N, not converted] | 0~125 N |
| Pressure set resolution [Parameter graphs 1.png; XBZN-1500 column/clear share] | ±0.4 N |
| Process precision [Parameter graphs 1.png; XBZN-1500 column/clear sharing grid; plane; RMS] | ≤7 nm |
| Process precision [Parameter graphs 1.png; XBZN-1500 column/clear sharing grid; non-ball; RMS] | ≤10 nm |
| Polished Surface Roughness Ra [Parameter graphs 1.png; XBZN-1500 column/clear share] | ≤1 nm |
| Surface Finish [Parameter graphs 1.png; XBZN-1500 column/clear share] | Better than level II |
| Bit struts again precision [Parameters 1.png; XBZN-1500 column/specific sharing grid; ISO 9283] | ±0.05 mm |
| Maximum load capacity for mechanical arm [Parameter graphs 1.png; XBZN-1500 column/clear share] | 120 Kg |
| Machine bed weight [Parameter graphs 1.png; XBZN-1500 column/clear share] | Approximately 3.2 |
| Dimensions [Parameter graphs 1.png; XBZN-1500 column/clear sharing grid; specification table text rows] | 3400 mm × 2100 mm × 3100 mm |
Datasheet
Please provide your email to download the datasheet.
Your name
Email Address
Invalid email format. Please try again.
Send Request
Supplier Information
Xibin Optoelectronics, full name Xibin Optoelectronics (Jiangsu) Co., Ltd. (established in June 2001 as Wuxi Xibin Optoelectronic Equipment Factory, changed to Wuxi Xibin Optoelectronic Equipment Co., Ltd. in April 2007, established Yancheng Xibin Optoelectronic Technology Co., Ltd. in April 2012, changed to Xibin Optoelectronics (Jiangsu) Co., Ltd. in 2021, and established an optical processing workshop at the end of 2021), is a high-tech enterprise specializing in the research and development, manufacturing and sales of optical cold processing equipment, as well as supporting processing technology and processing devices.
Xibin Optoelectronics has a well-trained, dedicated, and challenge-driven professional technical R&D team. It has long focused on product innovation and has received on-site guidance from Academician Pan Junhua and others.
Main products: intelligent ring polishing machine series, CNC single-axis flipping machine series, pneumatic flat swing precision grinding and polishing machine series, high-speed fine grinding and polishing machine series, variable frequency multi-axis machine series, cylindrical grinding and polishing machine series, intelligent surface milling machine, fully automatic wafer chamfering machine, chamfering machine, centrifuge, etc.
Product application: suitable for fine grinding and polishing of flat, cylindrical and spherical surfaces of materials such as glass, ceramics, sapphire, silicon wafers, mechanical seals, etc.
Technology leadership, reliable quality, and customer satisfaction are the company's purposes. We warmly welcome friends from all walks of life to visit and negotiate, let us work together and develop together! Xibin Optoelectronics is willing to be your trusted partner!
Contact Us
Loading...
GetExperimental Plan
Name
Phone
+86
Organization
Use Case

Global Photonics Products
Database Platform
Database Platform
With 16 years of experience, we provide high-quality products and services to universities, research institutes, and industry.
50+ Detailed Categories · 3,000+ Global Brands · 100,000+ Photonics Products
1 Million+
In-depth analysis of professional academic resources in photonics
300,000
ProductsDatasheets Available Free
We will keep your personal information strictly confidential.
Product Quote
+86
* Select the quoting party:
By submitting, you agree to the User Service Agreement and Privacy Policy