Vertical solidified furnace (orbiting) VCO-MR-20-01L
Baking and curing after dispensing, coating and potting in AI, 5G communications, 3C, consumer electronics, automotive electronics and semiconductor applications. Operating sequence: the upstream machine supplies the product; the loading robot transfers it to the selected layer; that layer's loading-side lift door opens; the product is placed in the oven chamber and the door closes; after baking, the corresponding layer's lift door opens; the unloading robot transfers the product to the next machine.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Maximum overboard size (L*W) [（ Customizable ）] | 550*450mm (customable) |
| Up and down. | It's all automatic. It's not manual. |
| Quicken | Auto-widening |
| Heating | Hot wind. |
| Baking temperature [Adjustable] | Temperature + 15°C ~ 200°C |
| Temperature Control Precision | ≤±1 |
| Temperature evenness | ≤±2 |
| The cure side. [(Detailable)] | 10mm (auto-serviceable) |
| Layers | 20 层 |
| Layers - Layers Spacing [(Detailable)] | 60mm (auto-described) |
| Product flow [(all)] | Left to right, right to left (all) |
| Sports | Hand-carrying, material-discharge, no slide, roller friction, and avoiding cardboard and offboard risk |
| Level of the board [Axes Z to Z; available for transfer] | The exit, the entrance, the Z-axis, 580 mm, 1780 mm. |
| CT | ＞15S |
| Information retroactive [Match] | Match |
| Whole machine size (L*W*H) | 2200 mm × 1500 mm × 2100 mm |
| Equipment Weight | 1850 KG |
| Power Supply Requirements [Three-by-five.] | Three-phase, five-wire AC380V/50HZ/60HZ |
| Pressure requirements | 0.4Mpa～0.6Mpa |
| Ambient Temperature | 10℃～30℃ |
| Environmental humidity [Non-condensing] | ≤80%, non-condensing |
Applications
Key Features
Datasheet
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