MEMS MxN light switch

MEMS MxN light switch

Supplier
Glsun
Category
Fiber Optic Switches
Origin
China

The mems matrix switch at Guilin Lumonic Technology Group Inc. has low penetration loss, speed of switching time and high reliability. In addition, the product has a CCD display screen and panel button, which are easy to operate, and the RJ45 port is used for external control.

Specification Snapshot
Insertion Loss [8×8;SUN-MEMS-M×N]
max:2.0 dB
Insertion Loss [16×16;SUN-MEMS-M×N]
max:2.5 dB
Insertion Loss [32×32;SUN-MEMS-M×N]
max:3.0 dB
Insertion Loss [64×64;SUN-MEMS-M×N]
max:5.0 dB
Return Loss [SUN-MEMS-M×N]
min:45 dB
Cross Talk [SUN-MEMS-M×N]
min:55 dB
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Overview

The mems matrix switch at Guilin Lumonic Technology Group Inc. has low penetration loss, speed of switching time and high reliability. In addition, the product has a CCD display screen and panel button, which are easy to operate, and the RJ45 port is used for external control.

Specifications

ParameterValue
Test Wavelength [SUN-MEMS-M×N]min:1260 nm; typical:1550 nm; max:1650 nm
Insertion Loss [8×8;SUN-MEMS-M×N]max:2.0 dB
Insertion Loss [16×16;SUN-MEMS-M×N]max:2.5 dB
Insertion Loss [32×32;SUN-MEMS-M×N]max:3.0 dB
Insertion Loss [64×64;SUN-MEMS-M×N]max:5.0 dB
Return Loss [SUN-MEMS-M×N]min:45 dB
Cross Talk [SUN-MEMS-M×N]min:55 dB
Polarization Dependent Loss [SUN-MEMS-M×N]typical:0.1 dB; max:0.25 dB
Wavelength Dependent Loss [SUN-MEMS-M×N]max:0.5 dB
Temperature-Dependent Loss [SUN-MEMS-M×N]max:0.5 dB
Switching Time [SUN-MEMS-M×N]max:30 ms
Repeatability [SUN-MEMS-M×N]typical:±0.05 dB
Maximum photopower [SUN-MEMS-M×N]max:500 mW
Repeatability [SUN-MEMS-M×N]min:10⁹
Operating Temperature [SUN-MEMS-M×N]min:-5 ℃; max:55 ℃
Storage Temperature [SUN-MEMS-M×N]min:-20 ℃; max:70 ℃
Relative humidity [SUN-MEMS-M×N]min:5 %; max:95 %
Connector Type [SUN-MEMS-M×N]LC/PC or other
Monitoring Port [SUN-MEMS-M×N]RJ45
Operating Power Supply [SUN-MEMS-M×N]Redundancy power: AC 100V ~ 240V or DC 36 ~ 72V
Power Consumption [SUN-MEMS-M×N]50 W
Size of the aircraft [1U;8×8;SUN-MEMS-M×N]1U: 483×303×44 (8×8)
Size of the aircraft [2U;16x16/32×32;SUN-MEMS-M×N]2U: 483×303×89 (16x16/32×32)
Size of the aircraft [4U;64×64;SUN-MEMS-M×N]4U: 483×303×177 (64×64)
Light Switch Type [SUN-MEMS-M×N]MEMS
Package Type [SUN-MEMS-M×N]Equipment
Port Configuration [SUN-MEMS-M×N]MxN

Applications

LAN Multi-Ray Source/Detector Automatically Switching and Photo-Sensor Multi-Perfect Dynamic Monitoring System (LIMS) Photochannel Monitoring or Control Fiber, Optical Devices, Network and Field Engineering Cable Tests Fibres and Optical Component Test System (LAS) Optical Transmission Network Testing (LAS) Photo-Sensoring, Photomonitoring

Key Features

Insert small losses, speed of switching, high stability, thick metal panel, strong and durable, quickly switching to the channel selected by panel or program command, locking the panel button by program command

Datasheet

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Supplier Information

Founded in 2001, Guilin GLSUN Science and Tech Group Co., Ltd. is a professional semiconductor optical chip full-process service provider in China. The company focuses on the integration of optoelectronic technology and intelligent computing, continuously innovating in core fields such as optical chips, optical switches, and optical isolators, while building comprehensive capabilities covering epitaxy, chip manufacturing, packaging, and testing. In the era of AI and big data, GLSUN is strategically focused on computing networks and data center applications, providing high-speed, low-power, and highly reliable optical interconnection solutions for general computing, supercomputing, and AI computing scenarios. Our core products include optical circuit switches OCS, MEMS optical switches, optical isolators and optical chips, while also advancing cutting-edge technologies such as WSS and thin-film lithium niobate chips. With strong in-house R&D and large-scale manufacturing capabilities, GLSUN is accelerating its transformation from a traditional optical communications company into an intelligent photonics innovation platform, supporting the next generation of digital infrastructure and AI computing development.

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