Anode Ion Sources
The rationale is that the gas is passed between the ion's anodes, based on the linear closed drift theory of the anodes. The positive voltage of the anodes interacts with the strong magnetic field attached to internal and external incipient extremes, producing the plasma, driven by the anode field, from the ejection from the sources of the plasma. Useful uses can be used as a source of clean ion cleaning on the surface of the foundation table. The adjunct of the foundation tablets can be used directly on the soft foundation tablets, and the optical membranes, oxides, ammonia, etc., as auxiliary depositions in the magnetic-control splatter process. The properties of the aerodynamic pressure, low volt pressure, high-fence flow. The low energy from the ion of the anortic ion is driven by the an an anthropod, the low energy, the east-to-east is effective to remove organic pollutants from the surface of the foundation table and the low-teres, and the low-te-te-te-te-te-res, which are very The institutional and material composition of the anode ion source allows it to be fully adapted to the vast majority of the reaction gases, such as nitrogen, oxygen, and argon. The ion source length can be built according to user needs.
Save to Favorites
Overview
Specifications
| Parameter | Value |
|---|---|
| Effective dimensions [Quite clearly the graph type JYK-YJM; JYK-YJM] | Depending on the type. |
| Maximum empty voltage [Model: JYK-YJM] | >1500 V |
| Operating Current [Quite clearly the graph type JYK-YJM; continuous truncable; JYK-YJM] | 0-5A continuous |
| Ion Energy [Quite clearly the graph type JYK-YJM; JYK-YJM] | 50-800 eV |
| Work Pressure [Quite clearly the graph type JYK-YJM; JYK-YJM] | 1×10⁻¹~5×10⁻¹Pa |
| Air flow [Quite clearly the graph type JYK-YJM; JYK-YJM] | 0-100 Sccm |
| Cooling pipes. [∙ specify the form type JYK-YJM; table unprinted in units without mm; JYK-YJM] | Φ8×1 |
| Cold water resistance. [Quote the table type JYK-YJM; size-like, without extrapolation M; JYK-YJM] | 50 KΩ/M |
| Control Method [Quite clearly the graph type JYK-YJM; JYK-YJM] | Local/Remote |
| Scope of application [Quite clearly the graph type JYK-YJM; JYK-YJM] | Plasma cleansing and assistive plating |
Applications
Datasheet
Please provide your email to download the datasheet.
Invalid email format. Please try again.
Supplier Information
Related Products
-
Coated Component
Material-based Production Equipment
Fuzhouzhiyi
-
Electro-Hydraulic Synchronous CNC Press Brake Machine 80T2500
Material-based Production Equipment
Auroralaser
Bending Capacity: 800 kN Bending Length: 2500 mm Distance Between Columns: 2000 mm
The Electro-Hydraulic Synchronous CNC Press Brake employs a high-precision electro-hydraulic control system and robust frame to ensure efficient, stable processing of complex bends, significantly enhancing production accuracy and profitability.
-
Electro-Hydraulic Synchronous CNC Press Brake Machine 110T2500
Material-based Production Equipment
Auroralaser
Bending Capacity: 1100 kN Bending Length: 2500 mm Distance Between Columns: 2000 mm
The Electro-Hydraulic Synchronous CNC Press Brake employs a high-precision electro-hydraulic control system and robust frame to ensure efficient, stable processing of complex bends, significantly enhancing production accuracy and profitability.
-
Electro-Hydraulic Synchronous CNC Press Brake Machine 110T4100
Material-based Production Equipment
Auroralaser
Bending Capacity: 1100 kN Bending Length: 4100 mm Distance Between Columns: 3500 mm
The Electro-Hydraulic Synchronous CNC Press Brake employs a high-precision electro-hydraulic control system and robust frame to ensure efficient, stable processing of complex bends, significantly enhancing production accuracy and profitability.
-
Wafer Bonding
Material-based Production Equipment
Jmwafer
晶沐光电 combines wafer grinding/polishing/thinning and laser processing to provide homogeneous/heterogeneous, permanent/temporary wafer bonding. High vacuum sealing, heat/pressure and surface activation create reliable interfaces for3D integration, advanced packaging, MEMS, power, RF and optoelectronic devices, including custom small batches for institutes. Referenced processes/equipment include single-wafer cleaning, class100 cleanroom bonding and KSB-H1000. Permanent bonding irreversibly joins wafers/chips into strong, hermetic, reliable structures. Direct bonding uses ultracleaning, plasma activation and CMP, room-temperature van der Waals prebonding and annealed Si-O-Si covalent bonds: no interlayer, high strength/hermeticity/insulation, void-free/low-stress interfaces for Si/Si, Si/SiO2 and Si/SOI. Anodic bonding uses heat/high electric field for silicon–glass chemical bonds, near-bulk strength, low leak rate and stable sealed cavities, such as Si/borosilicate. Eutectic bonding melts/diffuses Au-Sn, Cu-Sn, In or Au-Si interlayers, yielding low-temperature, conductive, thermally conductive, reliable bonds with broad process windows for Cu/Au/Sn-coated wafers. Thermocompression uses heat/precise pressure for solder-free metal-atom diffusion, high interconnect density/low interface resistance, and direct bonding of Si, metal-coated, compound-semiconductor, sapphire, glass, SiC or ceramic wafers. Hybrid bonding simultaneously joins copper/dielectric for integrated mechanical/electrical submicron-pitch connections, high bandwidth, low latency/loss and HBM/AI stacking in3D NAND, HBM, AI processors, high-end Chiplets and VLSI wafers. Examples are sapphire/Si, SiO2/sapphire and GaAs/Si. Temporary bonding glues a wafer/chip to a carrier for backside processing then gentle release. Thermal-slide bonding softens thermoplastics, PPC or polyimides with heat, hardens on cooling and reheats/slides for release; it resists heat/chemicals for Si thinning, TSV and advanced packaging, but needs heating and may leave adhesive. UV release cures for strength then shortwave UV degrades/debonds UV-release adhesive/double-sided tape: gentle room-temperature release for heat-sensitive MEMS, CIS, compound and ultrathin wafers, but needs a transparent carrier and has moderate heat resistance. Laser release uses transparent carriers and an absorbing layer to decompose/release adhesive without contact; laser-responsive coating plus bonding adhesive gives stress-free, residue-free, precise release for large ultrathin3D IC/HBM/Chiplet/advanced-packaging wafers, at high equipment/material cost. Low-melting In, SnBi or AuSn alloys bond molten and remelt for release; high heat tolerance/conductivity and acid/alkali resistance suit SiC/GaN power devices/high-temperature processes, but metal residue is difficult to clean and processing is complex. Bondable materials include Si, SiC, GaN, sapphire, GaAs, InP, quartz/borosilicate glass, alumina/aluminum-nitride ceramics, diamond, bonded composites, SOI, lithium tantalate/niobate and coated wafers.
Related Articles
Raybowlaser, a professional manufacturer of high-power laser chips, has officially launched its upgraded new-generation 1470nm high-performance laser chip. Achieving groundbreaking progress in rated output power and wall-plug efficiency (WPE), this innovative laser chip delivers superior and reliable core light source solutions for medical cosmetology, industrial processing, agricultural applications and scientific research equipment.
Electro-optic deflectors (EODs) are optical devices used to steer or deflect light beams by applying an electric field to a specialized optical crystal. Unlike mechanical beam steering systems that rely on moving mirrors, electro-optic deflectors enable high-speed, non-mechanical beam control with exceptional precision and responsiveness. They are widely used in laser scanning, optical communications, microscopy, laser printing, spectroscopy, and scientific research, where rapid and accurate laser beam positioning is essential.
Founded in 2004, Wuhan Union Optic Inc. is a National Specialized, Refined, Unique & Innovative "Little Giant" high-tech enterprise located in Wuhan East Lake High-Tech Development Zone.
Precise spectral screening is essential for high-precision medical detection, spectroscopic analysis and intelligent imaging systems. Tailored for visible and near-infrared spectral separation, the SP900 shortpass optical filter delivers high-efficiency light transmission and deep infrared blocking performance. It effectively eliminates stray light interference, improves signal-to-noise ratio (SNR), and serves as a core optical component for biomedical instruments, scientific analysis equipment and machine vision systems.
Loading...
Name
Phone
Organization
Use Case
Database Platform