JC series magnetic-control Spattered Membrane Plugging Machine JC650-1/D
• The magnetic-controlled film plating equipment is used primarily to plating metals, semiconductors, electrical media, multi-element compounds or mixtures on the base plate. Splashing is used to prepare metallic membranes, semiconductor membranes, insulations, rigid membranes, heat-resistant membranes, percolators, magnetic membranes, optical membranes, etc., for special properties. • Base sizes are adapted to a wide range, they are platable for a variety of materials, process is controlled, flexible, repetitive, high-temperature, base temperature rises, membranes are heavily concentrated, computers are fully automated, and reliable.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Application characteristics [Clear model: JC650-1/D] | For rectangular or circular piece pieces |
| Special features of the assembly desk [Clear model: JC650-1/D] | The work is public, horizontal. |
| Base size [Clear model: JC650-1/D] | Φ100 |
| Production/hour [Model: JC650-1/D; aluminum-layer thickness 1µm] | 10 |
| Thickness evenness [Clear model: JC650-1/D] | ±5 % |
| Vacuum system [Clear model: JC650-1/D] | Molecular Pump System (platform); cryogenic Pump System, dispersible pump System (optional) |
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