Double-Sided Grinding Machine TDL-1200
The two-sided grinder series is a high-precision, stable milling device with an upper, lower and inner ring-driven drive, tailored to client needs, to enable the two-sided grinding of various semiconductor materials by matching grinding plates with different materials and grinding fluids of different particles and materials. Product characteristics: pressurization: air-scaping methods; ratio valves to control pressure precisely; processing: double-sided; process optimization: unique grinding-side control process
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Overview
The two-sided grinder series is a high-precision, stable milling device with an upper, lower and inner ring-driven drive, tailored to client needs, to enable the two-sided grinding of various semiconductor materials by matching grinding plates with different materials and grinding fluids of different particles and materials. Product characteristics: pressurization: air-scaping methods; ratio valves to control pressure precisely; processing: double-sided; process optimization: unique grinding-side control process
Specifications
| Parameter | Value |
|---|---|
| Pressure | An airbag. |
| Stress grinding. | Max1000 kgf |
| Up and down CD size | OD1100 mm |
| cruise ship specifications | 14B*6 |
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Supplier Information
Beijing TSD Semiconductor Equipment Co., Ltd. is a national high-tech enterprise with independent intellectual property rights, focusing on the R&D, production, and sales of ultra-precision planar processing equipment for the semiconductor field. With the mission of "leading semiconductor technology progress and assisting customer development", it is committed to becoming a globally leading semiconductor equipment manufacturer.
Guided by the technology orientation of "flatter, thinner, more reliable", TSD deeply cultivates ultra-precision planar processing technology in fields such as semiconductor substrate materials, wafer manufacturing, semiconductor devices, advanced packaging, and MEMS, forming core technical advantages of leading technology, superior performance, and stable processes, and can provide systematic solutions and process equipment for thinning, polishing, and CMP.
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